ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
Wachmann, E, Saponara, S, Zambelli, C, Tisserand, P, Charbonnier, J, Erlbacher, T, Gruenler, S, Hartler, C, Siegert, J, Chassard, P, Ton, D M, Ferrari, L, Fanucci, L
Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.03.2016)
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Published in Proceedings - Design, Automation, and Test in Europe Conference and Exhibition (01.03.2016)
Journal Article
ATHENIS3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology
Wachmann, E., Saponara, S., Zambelli, C., Tisserand, P., Charbonnier, J., Erlbacher, T., Gruenler, S., Hartler, C., Siegert, J., Chassard, P., Ton, D. M., Ferrari, L., Fanucci, L.
Published in 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2016)
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Published in 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2016)
Conference Proceeding
Manufacturing and characterization of die to die interconnections for 3D applications in harsh environmental conditions
Hartler, C., Siegert, J., Schrank, F., Schrems, M., Hajdarevic, Z., Bulacher, S.
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
3D Si interposer & WLP for small power devices for harsh conditions
Charbonnier, J., Plihon, A., Assous, M., Argoud, M., Allouti, N., Moreau, S., David, N., Brunet-Manquat, C., Hartler, C., Siegert, J., Wachmann, E.
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
3D integration for power MOS H bridge power application
Charbonnier, J., Assous, M., Bally, J. P., Plihon, A., Hilt, T., Hassaine, A., Mourier, T., Manquat, C. Brunet, Franiatte, R., Guillaume, J., Hartler, C., Siegert, J., Schrank, F., Pressel, K., Gruber, H.
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests
Hartler, C., Moreau, S., Chery, E., Charbonnier, J., Siegert, J., Plihon, A., Assous, M., Mitsche, S., Simic, S., Schrank, F., Grogger, W.
Published in IEEE transactions on device and materials reliability (01.06.2018)
Published in IEEE transactions on device and materials reliability (01.06.2018)
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Magazine Article
Method of making sulphate pulp
SJOEDIN; LARS T, MJOEBERG; PER J, LEKANDER; KARL-ERIK, HARTLER; NILS J. C
Year of Publication 01.09.1987
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Year of Publication 01.09.1987
Patent
HERSTELLUNGSVERFAHREN MECHANISCHER PULPE
STRAND, CARLSTAD, WILLIAM, S-852 47 SUNDSVALL, SE, HARTLER, J., CH., NILS, S-181 64 LIDINGOE, SE
Year of Publication 19.05.1988
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Year of Publication 19.05.1988
Patent