Flexible Packaging by Film Assisted Molding for Microintegration of Inertia Sensors
Hera, Daniel, Berndt, Armin, Günther, Thomas, Schmiel, Stephan, Harendt, Christine, Zimmermann, André
Published in Sensors (Basel, Switzerland) (27.06.2017)
Published in Sensors (Basel, Switzerland) (27.06.2017)
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Journal Article
Hybrid Systems-in-Foil-Combining the Merits of Thin Chips and of Large-Area Electronics
Burghartz, Joachim N., Yu, Zili, Alavi, Golzar, Albrecht, Bjorn, Deuble, Thomas, Elsobky, Mourad, Ferwana, Saleh, Harendt, Christine, Mahsereci, Yigit, Richter, Harald
Published in IEEE journal of the Electron Devices Society (2019)
Published in IEEE journal of the Electron Devices Society (2019)
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Journal Article
High Dynamic Range CMOS Imager Technologies for Biomedical Applications
Graf, H.-G., Harendt, C., Engelhardt, T., Scherjon, C., Warkentin, K., Richter, H., Burghartz, J.N.
Published in IEEE journal of solid-state circuits (01.01.2009)
Published in IEEE journal of solid-state circuits (01.01.2009)
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Journal Article
Conference Proceeding
Thin Film on CMOS Active Pixel Sensor for Space Applications
Schulze Spuentrup, Jan Dirk, Burghartz, Joachim N, Graf, Heinz-Gerd, Harendt, Christine, Hutter, Franz, Nicke, Markus, Schmidt, Uwe, Schubert, Markus, Sterzel, Juergen
Published in Sensors (Basel, Switzerland) (13.10.2008)
Published in Sensors (Basel, Switzerland) (13.10.2008)
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Journal Article
Amorphous silicon based p-i-i-n photodetectors for point-of-care testing
Sämann, Marc, Furin, Dominik, Thielmann, Johannes, Pfäfflin, Albrecht, Proll, Günther, Harendt, Christine, Gauglitz, Günther, Schleicher, Erwin, Schubert, Markus B.
Published in Physica status solidi. C (01.04.2010)
Published in Physica status solidi. C (01.04.2010)
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Journal Article
Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates
Passlack, Ulrike, Simon, Nicolai, Bucher, Volker, Harendt, Christine, Stieglitz, Thomas, Burghartz, Joachim N.
Published in ACS applied materials & interfaces (29.03.2023)
Published in ACS applied materials & interfaces (29.03.2023)
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Journal Article
Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al 2 O 3 -TiO 2 Nanolaminates
Passlack, Ulrike, Simon, Nicolai, Bucher, Volker, Harendt, Christine, Stieglitz, Thomas, Burghartz, Joachim N
Published in ACS applied materials & interfaces (29.03.2023)
Published in ACS applied materials & interfaces (29.03.2023)
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Journal Article
Multi-Chip Patch in Low Stress Polymer Foils based on an Adaptive Layout for Flexible Sensor Systems
Albrecht, Bjoern, Alavi, Golzar, Elsobky, Mourad, Ferwana, Saleh, Passlack, Ulrike, Harendt, Christine, Burghartz, Joachim N.
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Characterization of On-Foil Sensors and Ultra-Thin Chips for HySiF Integration
Elsobky, Mourad, Deuble, Thomas, Ferwana, Saleh, Albrecht, Bjorn, Harendt, Christine, Ottaviani, Alessandro, Alomari, Mohammed, Burghartz, Joachim N.
Published in IEEE sensors journal (15.07.2020)
Published in IEEE sensors journal (15.07.2020)
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Journal Article
Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips
Harendt, Christine, Kostelnik, Jan, Kugler, Andreas, Lorenz, Enno, Saller, Stefan, Schreivogel, Alina, Yu, Zili, Burghartz, Joachim N.
Published in Solid-state electronics (01.11.2015)
Published in Solid-state electronics (01.11.2015)
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Journal Article
Ultra-thin chip technology and applications, a new paradigm in silicon technology
Burghartz, Joachim N., Appel, Wolfgang, Harendt, Christine, Rempp, Horst, Richter, Harald, Zimmermann, Martin
Published in Solid-state electronics (01.09.2010)
Published in Solid-state electronics (01.09.2010)
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Journal Article
Conference Proceeding
Thermal characterization and modeling of ultra-thin silicon chips
Alshahed, Muhammad, Yu, Zili, Rempp, Horst, Richter, Harald, Harendt, Christine, Burghartz, Joachim N.
Published in Solid-state electronics (01.11.2015)
Published in Solid-state electronics (01.11.2015)
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Journal Article
Measurement-Based Compact Thermal Model Extraction Methodology for Packaged ICs
Alshahed, Muhammad S., Zili Yu, Richter, Harald, Harendt, Christine, Burghartz, Joachim N.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
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Journal Article
Compensation of externally applied mechanical stress by stacking of ultrathin chips
Endler, Stefan, Rempp, Horst, Harendt, Christine, Burghartz, Joachim N.
Published in Solid-state electronics (01.08.2012)
Published in Solid-state electronics (01.08.2012)
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Journal Article
Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips
Endler, S., Ferwana, S., Rempp, H., Harendt, C., Burghartz, J. N.
Published in IEEE electron device letters (01.03.2012)
Published in IEEE electron device letters (01.03.2012)
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Journal Article
Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components
Mourad Elsobky, Golzar Alavi, Björn Albrecht, Thomas Deuble, Christine Harendt, Harald Richter, Zili Yu, Joachim N. Burghartz
Published in Proceedings (01.12.2018)
Published in Proceedings (01.12.2018)
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Journal Article
Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips
Harendt, Christine, Zili Yu, Burghartz, Joachim N., Kostelnik, Jan, Kugler, Andreas, Saller, Stefan
Published in 2014 44th European Solid State Device Research Conference (ESSDERC) (01.09.2014)
Published in 2014 44th European Solid State Device Research Conference (ESSDERC) (01.09.2014)
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Conference Proceeding