Nanosize of zinc oxide and the effects on zinc digestibility, growth performances, immune response and serum parameters of weanling piglets
Li, Ming-Zhe, Huang, Jie-Ting, Tsai, Yi-Hao, Mao, Syuan-Yian, Fu, Chao-Ming, Lien, Tu-Fa
Published in Animal science journal (01.11.2016)
Published in Animal science journal (01.11.2016)
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Journal Article
Numerical Analysis of the Vertical Crown Displacements in Triple Adjacent Tunnels with Rock Bolts and Pipe Roofings
Chen, Shong-Loong, Tsai, Yi-Hao, Zhang, Xiao-Ling, Tang, Chao-Wei, Hsu, Yu-Yun
Published in Processes (01.10.2022)
Published in Processes (01.10.2022)
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Journal Article
The influence of oxygen content in the sputtering gas on the self-synthesis of tungsten oxide nanowires on sputter-deposited tungsten films
Chen, Chao-Hsuing, Wang, Shui-Jinn, Ko, Rong-Ming, Kuo, Yi-Cheng, Uang, Kai-Ming, Chen, Tron-Min, Liou, Bor-Wen, Tsai, Hao-Yi
Published in Nanotechnology (14.01.2006)
Published in Nanotechnology (14.01.2006)
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Journal Article
Effects of changing adjacent building conditions on ground settlement profiles around deep excavation construction
Hsu, Chia-Feng, Tsai, Yi-Hao, Chen, Yue-Rong, Li, Yeou-Fong, Chen, Shong-Loong
Published in Journal of Asian architecture and building engineering (05.10.2024)
Published in Journal of Asian architecture and building engineering (05.10.2024)
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Journal Article
Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
Wang, Shui Jinn, Tsai, Hao Yi, Sun, Shi Chung
Published in Japanese Journal of Applied Physics (01.04.2001)
Published in Japanese Journal of Applied Physics (01.04.2001)
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Journal Article
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
Chuei-Tang Wang, Jeng-Shien Hsieh, Chang, Victor C. Y., En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Ron Chen, Ying-Ta Lu, Chewn-Pu Jou, Hao-Yi Tsai, Liu, C. S., Yu, Doug C. H.
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
Published in 2015 International 3D Systems Integration Conference (3DIC) (01.08.2015)
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Conference Proceeding
Characterization of sputtered tantalum carbide barrier layer for copper metallization
HAO YI TSAI, SUN, S. C, SHUI JINN WANG
Published in Journal of the Electrochemical Society (01.07.2000)
Published in Journal of the Electrochemical Society (01.07.2000)
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Journal Article
Chip-packaging interaction in Cu/very low-k interconnect
Hsiu-Ping Wei, Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng, Yu, D.C.H.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
Building friendship with Boss: Strategic prosocial behaviors in the agency model
Ho, Shirley J., Tsai, Yi Hao
Published in Journal of behavioral and experimental economics (01.06.2020)
Published in Journal of behavioral and experimental economics (01.06.2020)
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Journal Article
A self-aligned airgap interconnect scheme
Hsien-Wei Chen, Shin-Puu Jeng, Hao-Yi Tsai, Yu-Wen Liu, Hsiu-Ping Wei, Yu, D.C.H., Sun, Y.C.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
Characterization of sputtered titanium carbide film as diffusion barrier for copper metallization
SHUI JINN WANG, HAO YI TSAI, SUN, S. C
Published in Journal of the Electrochemical Society (01.08.2001)
Published in Journal of the Electrochemical Society (01.08.2001)
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Journal Article
Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization
SHUI JINN WANG, HAO YI TSAI, SUN, S. C, SHIAO, M. H
Published in Journal of the Electrochemical Society (01.09.2001)
Published in Journal of the Electrochemical Society (01.09.2001)
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Journal Article
Characterization of sputtered Ta-C-N film in the Cu/barrier/Si contact system
SHUI JINN WANG, HAO YI TSAI, SUN, S. C, SHIAO, M. H
Published in Journal of electronic materials (01.08.2001)
Published in Journal of electronic materials (01.08.2001)
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Journal Article
A Self-Aligned Air Gap Interconnect Process
Chen, Hsien-Wei, Jeng, Shin-Puu, Tsai, Hao-Yi, Liu, Yu-Wen, Yu, CH, Sun, YC
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding