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Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation
Zhang, Yonglin, Yao, Peilun, Han, Yuzi, Yang, Jun, Chen, Haibin, Wu, Jingshen, Yang, Jinglei
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.04.2022)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.04.2022)
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An even-load-distribution design for composite bolted joints using a novel circuit model and artificial neural networks
Qiu, Cheng, Han, Yuzi, Shanmugam, Logesh, Jiang, Fengyang, Guan, Zhidong, Du, Shanyi, Yang, Jinglei
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Year of Publication 15.05.2021
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