The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density
Han, Haneul, Lee, Chaerin, Kim, Youjung, Lee, Jinhyun, Yoon, Sanghwa, Yoo, Bongyoung
Published in Frontiers in chemistry (24.11.2022)
Published in Frontiers in chemistry (24.11.2022)
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Journal Article
전기 응고법을 이용한 커피박의 전처리 및 기능성 필터 특성 연구
박수빈(Soobin Park), 한하늘(Haneul Han), 박하늘(Haneul Park), 임승현(Seunghyun Lim), 유봉영(Bongyoung Yoo), 윤상화(Sanghwa Yoon)
Published in Biuletyn Uniejowski (2021)
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Published in Biuletyn Uniejowski (2021)
Journal Article
Electrodeposition of stress-relaxation-induced (111)-oriented nanotwin copper film by direct current in additive-free electrolyte
Han, Haneul, Seo, Jinmyeong, Kim, Youjung, Lee, Jinhyun, Park, Jungjoon, Yoon, Sanghwa, Yoo, Bongyoung
Published in Electrochimica acta (20.01.2024)
Published in Electrochimica acta (20.01.2024)
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Journal Article
Electrodeposition of Nickel-Tungsten Alloy with Functional Concentration Periodically Graded Material Structure for Low Stress and High Hardness
Park, Soobin, Han, Haneul, Seo, Jinmyeong, Park, Jungjoon, Yoon, Sanghwa, Yoo, Bongyoung
Published in Journal of the Electrochemical Society (01.02.2024)
Published in Journal of the Electrochemical Society (01.02.2024)
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Journal Article
Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
Han, Haneul, Lee, Chaerin, Kim, Youjung, Lee, Jinhyun, Kim, Rosa, Kim, Jongryoul, Yoo, Bongyoung
Published in Applied surface science (01.06.2021)
Published in Applied surface science (01.06.2021)
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Journal Article
Selective Copper Electrodeposition for Redistribution Layer by Varying Concentration and Agitation of Janus Green B
Lee, Jinhyun, Kim, Youjung, Han, Haneul, Yoon, Sanghwa, Lim, Jae-Hong, Yoo, Bongyoung
Published in ECS journal of solid state science and technology (01.11.2023)
Published in ECS journal of solid state science and technology (01.11.2023)
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Journal Article
Ru electrodeposition and behaviors of additives for advanced technology nodes
Kim, Youjung, Han, Haneul, Lee, Jinhyun, Yoo, Bongyoung
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)
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Conference Proceeding
Galvanic displacement deposition of Ag using citric acid for Cu-to-Cu hybrid bonding
Kim, Youjung, Yoon, Sanghwa, Han, Haneul, Seo, Jinmyeong, Park, Jungjoon, Yoo, Bongyoung
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01.05.2023)
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Conference Proceeding