Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties
Huo, Fupeng, Jin, Zhi, Han, Duy Le, Li, Jiahui, Zhang, Keke, Nishikawa, Hiroshi
Published in Journal of materials science & technology (20.10.2022)
Published in Journal of materials science & technology (20.10.2022)
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Journal Article
Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy
Han, Duy Le, Shen, Yu-An, He, Siliang, Nishikawa, Hiroshi
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.02.2021)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.02.2021)
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Journal Article
Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation
Huo, Fupeng, Jin, Zhi, Le Han, Duy, Zhang, Keke, Nishikawa, Hiroshi
Published in Materials & design (15.11.2021)
Published in Materials & design (15.11.2021)
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Journal Article
Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy
Le Han, Duy, Shen, Yu-An, Jin, Sanghun, Nishikawa, Hiroshi
Published in Journal of materials science (01.08.2020)
Published in Journal of materials science (01.08.2020)
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Journal Article
Development of a novel GTAW process for joining ultra-thin metal sheets
Manh, Ngo Huu, Nguyen, Van Anh, Le Duy, Han, Akihisa, Murata, Le, Van Thao, Ngoc, Trinh Quang, Gandham, Bharat
Published in Journal of manufacturing processes (01.08.2022)
Published in Journal of manufacturing processes (01.08.2022)
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Journal Article
Effect of 4.0 mass % Cu addition on microstructure and mechanical properties of In-48Sn alloy
Han, Duy Le, Park, Byungho, Nishikawa, Hiroshi
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys
Han, Duy Le, Tatsumi, Hiroaki, Huo, Fupeng, Nishikawa, Hiroshi
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
The effect of solid-state nanoporous Cu bonding for power device
Park, Byungho, Han, Duy le, Saito, Mikiko, Mizuno, Jun, Nishikawa, Hiroshi
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
Jin, Zhi, Huo, Fupeng, Han, Duy Le, Liu, Xunda, Tatsumi, Hiroaki, Chan, Y.C., Nishikawa, Hiroshi
Published in Thin solid films (01.06.2023)
Published in Thin solid films (01.06.2023)
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Journal Article
Unique characteristics of the novel-GTAW process for the butt joint of ultra-thin silicon steel sheets
Ngo, Manh Huu, Le, Van Thao, Gandham, Bharat, Nguyen, Van Anh, Le, Duy Han, Van, Truong Nguyen, Van, Tuan Nguyen
Published in Journal of manufacturing processes (06.01.2023)
Published in Journal of manufacturing processes (06.01.2023)
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Journal Article