Ultra-fine transformation of data for normality
Hamasha, Mohammad M., Ali, Haneen, Hamasha, Sa'd, Ahmed, Abdulaziz
Published in Heliyon (01.05.2022)
Published in Heliyon (01.05.2022)
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Journal Article
Effect of Aging on Component Reliability in Harsh Thermal Cycling
Akkara, Francy John, Zhao, Cong, Gordon, Seth, Su, Sinan, Abueed, Mohammed, Hamasha, Sa'd, Suhling, Jeff, Lall, Pradeep
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Markovian analysis of unreliable multi-machine flexible manufacturing cell
Hamasha, Mohammad, Hamasha, Sa'd, Aqlan, Faisal, Almeanazel, Osama
Published in PloS one (01.02.2022)
Published in PloS one (01.02.2022)
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Journal Article
Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints
Bani Hani, Dania, Al Athamneh, Raed, Abueed, Mohammed, Hamasha, Sa'd
Published in Scientific reports (26.05.2023)
Published in Scientific reports (26.05.2023)
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Journal Article
Author Correction: Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model
Bani Hani, Dania, Al Athamneh, Raed, Abueed, Mohammed, Hamasha, Sa'd
Published in Scientific reports (09.05.2023)
Published in Scientific reports (09.05.2023)
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Journal Article
Effect of temperature on the low cycle fatigue properties of BGA solder joints
Wei, Xin, Alahmer, Ali, Ali, Heneen, Tahat, Sufyan, Vyas, Palash Pranav, Hamasha, Sa’d
Published in Microelectronics and reliability (01.07.2023)
Published in Microelectronics and reliability (01.07.2023)
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Journal Article
The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature
Abueed, Mohammed, Al Athamneh, Raed, Tanash, Moayad, Hamasha, Sa’d
Published in Crystals (Basel) (01.09.2022)
Published in Crystals (Basel) (01.09.2022)
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Journal Article
Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions
Hamasha, Sa’d, Jaradat, Younis, Qasaimeh, Awni, Obaidat, Mazin, Borgesen, Peter
Published in Journal of electronic materials (01.12.2014)
Published in Journal of electronic materials (01.12.2014)
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Journal Article
Drop Shock Testing Analysis at Elevated Temperature: Assessing SAC305 Solder Alloy Reliability in BGA Assemblies
Vyas, Palash Pranav, Alahmer, Ali, Bolanos, Sergio, Alavi, Seyed Soroosh, Hamasha, Sa'd
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2024)
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Journal Article