Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, Bernhard, Becker, K.-F., Sinning, R., Wittler, O., Schacht, R., Walter, H., Schneider-Ramelow, M., Halser, K., Simper, N., Michel, B., Reichl, H.
Published in Microsystem technologies : sensors, actuators, systems integration (01.09.2009)
Published in Microsystem technologies : sensors, actuators, systems integration (01.09.2009)
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Journal Article
Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K., Topper, M., Krause, F., Halser, K., Hahn, R., Ehrmann, O., Reichl, H.
Published in Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) (1999)
Published in Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) (1999)
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Conference Proceeding