Finite Element Modeling Strategies for Studying Mechanical Design Tradeoffs in Heterogeneously Integrated Packages
Halbrooks, David N., Subbarayan, Ganesh, Wang, Huayan, Refai-Ahmed, Gamal, Ramalingam, Suresh
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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