Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae, Hyun‐Cheol, Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung
Published in ETRI journal (01.12.2013)
Published in ETRI journal (01.12.2013)
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Journal Article
Interconnection Technology Based on InSn Solder for Flexible Display Applications
Choi, Kwang‐Seong, Lee, Haksun, Bae, Hyun‐Cheol, Eom, Yong‐Sung, Lee, Jin Ho
Published in ETRI journal (01.04.2015)
Published in ETRI journal (01.04.2015)
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Journal Article
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Lee, Haksun, Choi, Kwang-Seong, Eom, Yong-Sung, Bae, Hyun-Cheol, Lee, Jin Ho
Published in ETRI journal (31.12.2016)
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Published in ETRI journal (31.12.2016)
Journal Article
Interconnection Technology Based on InSn Solder for Flexible Display Applications
Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Eom, Yong-Sung, Lee, Jin Ho
Published in ETRI journal (30.04.2015)
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Published in ETRI journal (30.04.2015)
Journal Article
HV-SoP Technology for Maskless Fine-Pitch Bumping Process
Son, Jihye, Eom, Yong-Sung, Choi, Kwang-Seong, Lee, Haksun, Bae, Hyun-Cheol, Lee, Jin-Ho
Published in ETRI journal (30.06.2015)
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Published in ETRI journal (30.06.2015)
Journal Article
Fine-Pitch Solder on Pad Process for Microbump Interconnection
Bae, Hyun-Cheol, Lee, Haksun, Choi, Kwang-Seong, Eom, Yong-Sung
Published in ETRI journal (31.12.2013)
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Published in ETRI journal (31.12.2013)
Journal Article
Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature
Li, Jiaxiong, Ren, Chao, Sun, Zhijian, Ren, Yanjuan, Lee, Haksun, Moon, Kyoung-sik, Wong, Ching-Ping
Published in ACS applied materials & interfaces (07.04.2021)
Published in ACS applied materials & interfaces (07.04.2021)
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Journal Article
Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters
Haksun Lee, Smet, Vanessa, Raj, P. M., Tummala, Rao
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Characterization of hybrid underfill for low-temperature process applicable to flexible substrate
Jihye Son, Yong-sung Eom, Kwang-seong Choi, Haksun Lee, Hyun-cheol Bae, Jin-ho Lee
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Characterization of 3D stacked high resistivity Si interposers with polymer TSV liners for 3D RF module
Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Kangwook Lee, Fukushima, Takafumi, Koyanagi, Mitsumasa, Jin HoLee
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding
Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung, Bae, Hyun‐Cheol, Lee, Jin Ho
Published in ETRI journal (01.12.2016)
Published in ETRI journal (01.12.2016)
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Journal Article
HV‐SoP Technology for Maskless Fine‐Pitch Bumping Process
Son, Jihye, Eom, Yong‐Sung, Choi, Kwang‐Seong, Lee, Haksun, Bae, Hyun‐Cheol, Lee, Jin‐Ho
Published in ETRI journal (01.06.2015)
Published in ETRI journal (01.06.2015)
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Journal Article
Issues of contact etching and pre-treatment in Schottky contact
Lee, Haksun, Shin, Kyoungsub, Cho, Nammyun, Min, Gyungjin, Kang, Changjin, Han, Woosung, Moon, Jootae
Published in Thin solid films (29.05.2009)
Published in Thin solid films (29.05.2009)
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Journal Article
Conference Proceeding
Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications
Kim, Yeongseon, Kim, Juhyeon, Kim, Hyoeun, Lee, Haksun, Kim, Dohyun, Seo, Sun-Kyoung, Jo, Chajea, Kim, Dae-Woo
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Cost-effective thermoelectric cooler packaging using hybrid Cu paste
Hyun-Cheol Bae, Yong-Sung Eom, Aesun Oh, Haksun Lee, Kwang-Seong Choi, Seung Eon Moon, Jin Ho Lee
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding