Surface quality of tribochemically polished silicon nitride
HAH, S. R, BURK, C. B, FISCHER, T. E
Published in Journal of the Electrochemical Society (01.04.1999)
Published in Journal of the Electrochemical Society (01.04.1999)
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Journal Article
Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects
Park, K.-C., Kim, I.-R., Suh, B.-S., Choi, S.-M., Song, W.-S., Wee, Y.-J., Lee, S.-G., Chung, J.-S., Chung, J.-H., Hah, S.-R., Ahn, J.-H., Lee, K.-T., Kang, H.-K., Suh, K.-P.
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
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Conference Proceeding
Improved planarization method using sandwiched hard layer (SHaL) CMP
Kim, J.Y., Yoon, B.U., Hah, S.R., Moon, J.T., Lee, S.I.
Published in ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) (1999)
Published in ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361) (1999)
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Conference Proceeding