Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits
Melamed, Samson, Imura, Fumito, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh, Aoyagi, Masahiro
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2019)
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Journal Article
Wide bus chip-to-chip interconnection technology using fine pitch bump joint array for 3D LSI chip stacking
Aoyagi, M., Imura, F., Nemoto, S., Watanabe, N., Kato, F., Kikuchi, K., Nakagawa, H., Hagimoto, M., Uchida, H., Matsumoto, Y.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
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Conference Proceeding
COOL interconnect low power interconnection technology for scalable 3D LSI design
Chacin, M., Uchida, H., Hagimoto, M., Miyazaki, T., Ohkawa, T., Ikeno, R., Matsumoto, Y., Imura, F., Suzuki, M., Kikuchi, K., Nakagawa, H., Aoyagi, M.
Published in 2011 IEEE Cool Chips XIV (01.04.2011)
Published in 2011 IEEE Cool Chips XIV (01.04.2011)
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Conference Proceeding
Investigation of effects of die thinning on central TSV bus driver thermal performance
Melamed, Samson, Imura, Fumito, Aoyagi, Masahiro, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
Published in 20th International Workshop on Thermal Investigations of ICs and Systems (01.09.2014)
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Conference Proceeding
Method for back-annotating per-transistor power values onto 3DIC layouts to enable detailed thermal analysis
Melamed, Samson, Imura, Fumito, Aoyagi, Masahiro, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
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Conference Proceeding
Manycore processor for video mining applications
Matsumoto, Y., Uchida, H., Hagimoto, M., Hibi, Y., Torii, S., Izumida, M.
Published in 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2013)
Published in 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC) (01.01.2013)
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Conference Proceeding
Cool System scalable 3-D stacked heterogeneous Multi-Core / Multi-Chip architecture for ultra low-power digital TV applications
Matsumoto, Y., Morimoto, T., Hagimoto, M., Uchida, H., Hikichi, N., Imura, F., Nakagawa, H., Aoyagi, M.
Published in 2012 IEEE COOL Chips XV (01.04.2012)
Published in 2012 IEEE COOL Chips XV (01.04.2012)
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Conference Proceeding