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"Hada, Sayuri"
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"Hada, Sayuri"
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CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
by
SUEOKA KUNIAKI
,
HADA SAYURI
,
HORIBE AKIHIRO
Year of Publication
26.05.2016
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THICKNESS DETERMINATION METHOD OF INTERPOSER, COMPUTER PROGRAM, INTERPOSER AND CHIP PACKAGING STRUCTURE
by
HADA SAYURI
,
HORIBE AKIHIRO
,
MATSUMOTO KEIJI
Year of Publication
08.06.2015
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INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
by
HISADA, Takashi
,
YAMAMICHI, Shintaro
,
AOKI, Toyohiro
,
HADA
,
Sayuri
Year of Publication
25.09.2024
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INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
by
HISADA, Takashi
,
YAMAMICHI, Shintaro
,
AOKI, Toyohiro
,
HADA
,
Sayuri
Year of Publication
25.05.2023
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INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
by
Aoki, Toyohiro
,
Hisada, Takashi
,
Yamamichi, Shintaro
,
Hada
,
Sayuri
Year of Publication
18.05.2023
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Reduction of warpage of multilayered substrate or package
by
Matsumoto Keiji
,
Hada Sayuri
Year of Publication
06.06.2017
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Circuit module and manufacturing method thereof
by
Horibe, Akihiro
,
Sueoka, Kuniaki
,
Hada
,
Sayuri
Year of Publication
09.06.2020
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Method of reducing warpage of an organic substrate
by
Okamoto, Keishi
,
Mori, Hiroyuki
,
Hada
,
Sayuri
Year of Publication
17.03.2020
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REDUCTION OF WARPAGE OF MULTILAYERED SUBSTRATE OR PACKAGE
by
Matsumoto Keiji
,
Hada Sayuri
Year of Publication
28.07.2016
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Reduction of warpage of multilayered substrate or package
by
HADA SAYURI
,
MATSUMOTO KEIJI
Year of Publication
05.07.2016
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REDUCTION OF WARPAGE OF MULTILAYERED SUBSTRATE OR PACKAGE
by
HADA SAYURI
,
MATSUMOTO KEIJI
Year of Publication
03.09.2015
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METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
by
Okamoto, Keishi
,
Mori, Hiroyuki
,
Hada
,
Sayuri
Year of Publication
14.02.2019
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CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
by
HORIBE, Akihiro
,
HADA
,
Sayuri
,
SUEOKA, Kuniaki
Year of Publication
20.12.2018
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Circuit module and manufacturing method thereof
by
Horibe, Akihiro
,
Sueoka, Kuniaki
,
Hada
,
Sayuri
Year of Publication
11.09.2018
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Method of reducing warpage of an orgacnic substrate
by
Okamoto, Keishi
,
Mori, Hiroyuki
,
Hada
,
Sayuri
Year of Publication
08.05.2018
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Injection molded solder head with improved sealing performance
by
HADA SAYURI
,
HISADA TAKASHI
,
YAMAMICHI SHINTARO
,
AOKI TOYOHIRO
Year of Publication
28.05.2024
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METHOD OF REDUCING WARPAGE OF AN ORGACNIC SUBSTRATE
by
Mori Hiroyuki
,
Hada Sayuri
,
Okamoto Keishi
Year of Publication
18.05.2017
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Injection molded solder head with improved sealing performance
by
HADA
,
SAYURI
,
AOKI, TOYOHIRO
,
HISADA, TAKASHI
,
YAMAMICHI, SHINTARO
Year of Publication
11.01.2024
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Method, apparatus, and structure for determining interposer thickness
by
Matsumoto Keiji
,
Hada Sayuri
,
Horibe Akihiro
Year of Publication
14.02.2017
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Injection molded solder head with improved sealing performance
by
HADA
,
SAYURI
,
AOKI, TOYOHIRO
,
HISADA, TAKASHI
,
YAMAMICHI, SHINTARO
Year of Publication
01.06.2023
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