New flip-chip assembly system for prototyping and process investigations
Drozd, Z., Hackiewicz, H., Jezior, R., Lasocki, J., Lukasik, W., Orzechowski, J., Szwech, M.
Published in 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) (2001)
Published in 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) (2001)
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Conference Proceeding
Parameters of UV laser microvia formation based on Taguchi method of experiment design
Borecki, J., Hackiewicz, H., Koziol, G., Sitek, J., Codreanu, N.D.
Published in 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003 (2003)
Published in 26th International Spring Seminar on Electronics Technology: Integrated Management of Electronic Materials Production, 2003 (2003)
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Conference Proceeding