Cobalt fill for advanced interconnects
Bekiaris, Nikolaos, Zhiyuan Wu, Ren, He, Naik, Mehul, Jin Hee Park, Lee, Mark, Tae Hong Ha, Wenting Hou, Bakke, Jonathan R., Gage, Max, You Wang, Jianshe Tang
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
IL-6 and IL-10 Levels, Rather Than Viral Load and Neutralizing Antibody Titers, Determine the Fate of Patients With Severe Fever With Thrombocytopenia Syndrome Virus Infection in South Korea
Yoo, Jeong Rae, Kim, Tae-Jin, Heo, Sang Taek, Hwang, Kyung-Ah, Oh, Hyunjoo, Ha, TaeHong, Ko, Hye Kyung, Baek, Seungjae, Kim, Ju Eun, Kim, Jun Hyeong, Lee, Jiin, Kang, Min Ji, Yoo, Mi Soo, Kim, Jung Mogg, Lee, Kyung-Mi, Lee, Keun Hwa
Published in Frontiers in immunology (17.08.2021)
Published in Frontiers in immunology (17.08.2021)
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Journal Article
The effects of STI process parameters on the integrity of dual gate oxides
Hoon Lim, Seung-Jae Lee, Jong-Mil Youn, Tae-Hong Ha, Jin-Ho Kim, Bong-Hyun Choi, Ki-Joon Kim, Ho-Jin Kim, Kyeong-Tae Kim, Hyun-Geun Byun
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
Published in 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167) (2001)
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Conference Proceeding
Ruthenium liner and cap for back-end-of-line
Tang, Xianmin, Chen, Lu, Xu, Wenjing, Wu, Zhiyuan, Ha, Tae Hong, Chen, Feng
Year of Publication 10.10.2023
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Year of Publication 10.10.2023
Patent
Ruthenium liner and cap for back-end-of-line applications
Tang, Xianmin, Chen, Lu, Xu, Wenjing, Wu, Zhiyuan, Ha, Tae Hong, Chen, Feng
Year of Publication 19.09.2023
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Year of Publication 19.09.2023
Patent
Deposition of metal films with tungsten liner
Xu, Yi, Lee, Sang-Hyeob, Tang, Xianmin, Pabelico, Chris, Ha, Tae Hong, Park, Jin Hee, Lei, Yu
Year of Publication 02.04.2024
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Year of Publication 02.04.2024
Patent
Binary metal liner layers
Shen, Gang, Tang, Xianmin, Xu, Wenjing, Wu, Zhiyuan, Sabba, Yizhak, Ha, Tae Hong, Chen, Feng
Year of Publication 21.02.2023
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Year of Publication 21.02.2023
Patent
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
Tang, Xianmin, Chen, Lu, Xu, Wenjing, Wu, Zhiyuan, Ha, Tae Hong, Chen, Feng
Year of Publication 27.10.2022
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Year of Publication 27.10.2022
Patent
Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill
Xu, Yi, Lei, Wei, Ha, Tae Hong, Lei, Yu, Hung, Raymond, Pethe, Shirish A
Year of Publication 16.08.2022
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Year of Publication 16.08.2022
Patent
Extreme Contact Scaling with Advanced Metallization of Cobalt
Hung, Raymond, Park, Jin Hee, Ha, Tae Hong, Lee, Mark, Hou, Wenting, Lei, Jianxin, Bakke, Jonathan R., Sharma, Shashank, Sharma, Karthik Raman, Kim, Nam Sung, Yeh, Ellie, Wachs, Amir
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
Published in 2018 IEEE International Interconnect Technology Conference (IITC) (01.06.2018)
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Conference Proceeding
Methods and apparatus for precleaning and treating wafer surfaces
Tang, Xianmin, Chen, Lu, Xu, Wenjing, Kamath, Aravind, Jansen, Alexander, Tsai, Cheng-Hsiung Matthew, Ha, Tae Hong, Xie, Xiangjin, Leal Cervantes, Carmen, Chen, Feng
Year of Publication 26.03.2024
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Year of Publication 26.03.2024
Patent
METAL CAP FOR CONTACT RESISTANCE REDUCTION
Mebarki, Bencherki, Kuratomi, Takashi, Lee, Joung Joo, Wu, Liqi, Tang, Xianmin, Hou, Wenting, Gelatos, Avgerinos V, Lei, Jianxin, Hung, Raymond Hoiman, Ha, Tae Hong
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
Patent
Doping of metal barrier layers
Shen, Gang, Tang, Xianmin, Chen, Lu, Engler, Christina L, Ha, Tae Hong, Chen, Feng
Year of Publication 08.03.2022
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Year of Publication 08.03.2022
Patent
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
Tang, Xianmin, Chen, Lu, Xu, Wenjing, Wu, Zhiyuan, Ha, Tae Hong, Chen, Feng
Year of Publication 27.01.2022
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Year of Publication 27.01.2022
Patent