Exomic analysis of myxoid liposarcomas, synovial sarcomas, and osteosarcomas
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Published in Genes chromosomes & cancer (01.01.2014)
Published in Genes chromosomes & cancer (01.01.2014)
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Journal Article
Effective Substrate Thermal Conductivity Modeling Method Extracted from Detailed Pattern for Premium SOC Packages
Hwang, Seungtae, Lee, Bang weon, Kim, Taehwan, Hyun, Younghoon, Hwang, Heejung, Ryu, Seunggeol, Choi, Mina, Kim, Youngdeuk, Oh, DanKyung Suk
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Development and Application of the RFID System for Patient Safety
Jung, Eun-young, Park, Rae Woong, Lim, Yong Su, Hwang, Heejung, Lee, Young Ho, Jeong, Kug Sang, Park, Dong Kyun
Published in Taehan Ŭiryo Chŏngbo Hakhoe chi (01.12.2009)
Published in Taehan Ŭiryo Chŏngbo Hakhoe chi (01.12.2009)
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Journal Article
Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems
Kim, Taehwan, Lee, Jonggyu, Kim, Jaechoon, Lee, Eung-Chang, Hwang, Heejung, Kim, Youngdeuk, Oh, Dan Kyung Suk
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Set-level thermal management with package thermal design in digital TV application
Eun Seok Cho, Mi-Na Choi, Chung-Hyo Jung, Jaewook Yoo, Heejung Hwang, Heeseok Lee, Kiwon Choi, Sayoon Kang
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond
Kim, Taehwan, Lee, Jonggyu, Kim, Youngdeuk, Park, Hwanjoo, Hwang, Heejung, Kim, Jaechoon, Jung, Hangi, Kim, Dong Wook
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
SEMICONDUCTOR PACKAGE
KIM, Jaechoon, KIM, Youngdeuk, OH, Kyungsuk, KIM, Taehwan, Hwang, Heejung
Year of Publication 11.01.2024
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Year of Publication 11.01.2024
Patent
SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF
CHOI MI-NA, KIM JAE CHOON, BAE SERAN, CHO EUNSEOK, CHOI KYOUNGSEI, HWANG HEEJUNG
Year of Publication 03.07.2014
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Year of Publication 03.07.2014
Patent
Semiconductor devices and methods of controlling temperature thereof
CHOI MI-NA, KIM JAE CHOON, BAE SERAN, CHO EUNSEOK, CHOI KYOUNGSEI, HWANG HEEJUNG
Year of Publication 08.04.2014
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Year of Publication 08.04.2014
Patent