Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation
Huo, Fupeng, Jin, Zhi, Le Han, Duy, Zhang, Keke, Nishikawa, Hiroshi
Published in Materials & design (15.11.2021)
Published in Materials & design (15.11.2021)
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Journal Article
Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition
Jin, Zhi, Shen, Yu-An, Huo, Fupeng, Chan, Y. C., Nishikawa, Hiroshi
Published in Journal of materials science (01.06.2021)
Published in Journal of materials science (01.06.2021)
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Journal Article
Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging
Huo, Fupeng, Chen, Chuantong, Zhang, Zheng, Wang, Ye, Suetake, Aiji, Takeshita, Kazutaka, Yamaguchi, Yoshiji, Momose, Yashima, Suganuma, Katsuaki
Published in Materials & design (01.04.2024)
Published in Materials & design (01.04.2024)
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Journal Article
Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
Huo, Fupeng, Chen, Chuantong, Zhang, Zheng, Zhang, Yicheng, Suetake, Aiji, Takeshita, Kazutaka, Yamaguchi, Yoshiji, Momose, Yashima, Zhang, Keke, Suganuma, Katsuaki
Published in Journal of materials research and technology (01.07.2024)
Published in Journal of materials research and technology (01.07.2024)
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Journal Article
Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere
He, Siliang, Shen, Yu-An, Xiong, Bifu, Huo, Fupeng, Li, Jiahui, Ge, Jinguo, Pan, Zhiliang, Li, Wangyun, Hu, Chuan, Nishikawa, Hiroshi
Published in Journal of materials research and technology (01.11.2022)
Published in Journal of materials research and technology (01.11.2022)
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Journal Article
Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
Xu, Yuxin, Qiu, Xiaoming, Wang, Suyu, Huo, Fupeng, Su, Yutai, Xu, Long, Ma, Ninshu, Chen, Chuantong, Suganuma, Katsuaki
Published in Journal of alloys and compounds (25.08.2024)
Published in Journal of alloys and compounds (25.08.2024)
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Journal Article
Electromigration-induced microstructure evolution and failure mechanism of sintered nano-Ag joint
Jin, Zhi, Huo, Fupeng, Wang, Jianhao, Liu, Xunda, Chan, Y.C., Nishikawa, Hiroshi
Published in Materials characterization (01.11.2023)
Published in Materials characterization (01.11.2023)
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Journal Article
The Interfacial Intermetallic and Shear Strength of Ni Nanoparticle‐Decorated Reduced Graphene Oxide Reinforced Sn2.5Ag0.5Cu Lead‐Free Composite Soldering Joints
Huo, Fupeng, Zhang, Keke, Zhang, Meng, Wang, Huigai
Published in Advanced engineering materials (01.10.2018)
Published in Advanced engineering materials (01.10.2018)
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Journal Article
The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
Jin, Zhi, Huo, Fupeng, Han, Duy Le, Liu, Xunda, Tatsumi, Hiroaki, Chan, Y.C., Nishikawa, Hiroshi
Published in Thin solid films (01.06.2023)
Published in Thin solid films (01.06.2023)
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Journal Article
Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability
Chen, Chuantong, Suetake, Aiji, Huo, Fupeng, Kim, Dongjin, Zhang, Zheng, Hsieh, Ming-Chun, Li, Wanli, Wakasugi, Naoki, Takeshita, Kazutaka, Yamaguchi, Yoshiji, Momose, Yashima, Suganuma, Katsuaki
Published in IEEE transactions on power electronics (01.09.2024)
Published in IEEE transactions on power electronics (01.09.2024)
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Journal Article
Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method
Huo, Fupeng, Shen, Yu-An, He, Siliang, Zhang, Keke, Nishikawa, Hiroshi
Published in Vacuum (01.09.2021)
Published in Vacuum (01.09.2021)
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Journal Article
Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module
Huo, Fupeng, Chen, Chuantong, Zhang, Zheng, Zhang, Yicheng, Suetake, Aiji, Takeshita, Kazutaka, Yamaguchi, Yoshiji, Momose, Yashima, Suganuma, Katsuaki
Published in Materials characterization (01.11.2024)
Published in Materials characterization (01.11.2024)
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Journal Article
Microstructure characteristics for improved thermal shock reliability of sintered AgAl paste in SiC power module
Huo, Fupeng, Chen, Chuantong, Zhang, Zheng, Zhang, Yicheng, Suetake, Aiji, Takeshita, Kazutaka, Yamaguchi, Yoshiji, Momose, Yashima, Suganuma, Katsuaki
Published in Materials characterization (01.11.2024)
Published in Materials characterization (01.11.2024)
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Journal Article
Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties
Huo, Fupeng, Jin, Zhi, Han, Duy Le, Li, Jiahui, Zhang, Keke, Nishikawa, Hiroshi
Published in Journal of materials science & technology (20.10.2022)
Published in Journal of materials science & technology (20.10.2022)
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Journal Article
Corrigendum to ‘Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method’ [Vacuum 191 (2021)110370]
Huo, Fupeng, Shen, Yu-An, He, Siliang, Zhang, Keke, Nishikawa, Hiroshi
Published in Vacuum (01.10.2021)
Published in Vacuum (01.10.2021)
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Journal Article
Interfacial reactions between In and Ag during solid liquid interdiffusion process
Liu, Xunda, Huo, Fupeng, Wang, Jianhao, Tatsumi, Hiroaki, Jin, Zhi, Chen, Zhong, Nishikawa, Hiroshi
Published in Surfaces and interfaces (01.02.2024)
Published in Surfaces and interfaces (01.02.2024)
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