High-Performance and Low-Cost 10-Gb/s Bidirectional Optical Subassembly Modules
SHIH, Tien-Tsorng, LIN, Min-Ching, TSENG, Pei-Hao, LI, Chang-You, HUNG, Tuan-Yu, CHIU, Yi-Jen, CHENG, Wood-Hi
Published in Journal of lightwave technology (01.11.2007)
Published in Journal of lightwave technology (01.11.2007)
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Journal Article
Electro-thermal finite element analysis and verification of power module with aluminum wire
Liao, Li-Ling, Hung, Tuan-Yu, Liu, Chun-Kai, Li, Wei, Dai, Ming-Ji, Chiang, Kuo-Ning
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Journal Article
Conference Proceeding
Light degradation test and design of thermal performance for high-power light-emitting diodes
Su, Yen-Fu, Yang, Shin-Yueh, Hung, Tuan-Yu, Lee, Chang-Chun, Chiang, Kuo-Ning
Published in Microelectronics and reliability (01.05.2012)
Published in Microelectronics and reliability (01.05.2012)
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Journal Article
Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period
Hung, Tuan-Yu, Huang, Chao-Jen, Lee, Chang-Chun, Wang, Chin-Chun, Lu, Keng-Cheng, Chiang, Kuo-Ning
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Conference Proceeding
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact
Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Yew, Ming-Chih, Yang, Wen-Kun, Chiang, Kuo-Ning
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Journal Article
Conference Proceeding
Bonding wire life prediction model of the power module under power cycling test
Tuan-Yu Hung, Chin-Chun Wang, Kuo-Ning Chiang
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Reliability analysis of copper bump interconnection in double-sided power module
Chia-Chi Tsai, Li-Ling Liao, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
Study on configuration design of interconnection in high power module
Li-Ling Liao, Tuan-Yu Hung, Chun-Kai Liu, Yen-Fu Su, Kuo-Ning Chiang
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods
Kuan-Chung Lin, Chia-Chi Tsai, Yen-Fu Su, Tuan-Yu Hung, Kuo-Ning Chiang
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding
Thermal design and transient analysis of insulated gate bipolar transistors of power module
Tuan-Yu Hung, Shih-Ying Chiang, Chan-Yen Chou, Chien-Chia Chiu, Kuo-Ning Chiang
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2010)
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Conference Proceeding
Electro-thermal analysis of the Insulated Gate Bipolar Transistor module subjected to power cycling test using specified boundary condition technology
Shih-Ying Chiang, Tuan-Yu Hung, Hsien-Chih Ou, Kuo-Ning Chiang
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
A study on the thermal performance of a chip-in-substrate-type LED package structure
Yen-Fu Su, Tuan-Yu Hung, Shin-Yueh Yang, Kuo-Ning Chiang
Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
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Conference Proceeding
A study of thermal performance for chip-in-substrate package on package
Tuan-Yu Hung, Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
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Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)
Conference Proceeding
Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test
Sano, M., Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Kuo-Ning Chiang
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis
Chan-Yen Chou, Tuan-Yu Hung, Sano, M., Shin-Yueh Yang, Kuo-Ning Chiang
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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Conference Proceeding