Search Results - "HUNG, TZUNG-LI" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Using affinity set on mining the necessity of computed tomography scanning

Using affinity set on mining the necessity of computed tomography scanning

by Chen, Yuh-Wen, Larbani, Moussa, Li, Tzung-Hung, Chen, Chao-Wen
Published in 2009 IEEE/INFORMS International Conference on Service Operations, Logistics and Informatics (01.07.2009)

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Conference Proceeding

A RFID model of transferring and tracking trauma patients after a large disaster

A RFID model of transferring and tracking trauma patients after a large disaster

by Chen, Yuh-Wen, Wang, Guan-Jie, Li, Tzung-Hung, Yang, Tzung-Min, Shiu, Ting-Wei, Tasi, Meng-Shian, Jeng, Ya-Wen, Chen, Chao-Wen
Published in 2009 IEEE/INFORMS International Conference on Service Operations, Logistics and Informatics (01.07.2009)

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Conference Proceeding

CHIP ON FILM PACKAGE STRUCTURE

CHIP ON FILM PACKAGE STRUCTURE

by WU, CHENG-HUNG, HUNG, TZUNG-LI, CHEN, PIANG, HUANG, JUI-TAO
Year of Publication 01.07.2024

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Patent

Chip on film package structure

Chip on film package structure

by WU, CHENG-HUNG, HUNG, TZUNG-LI, CHEN, PIANG, HUANG, JUI-TAO
Year of Publication 16.06.2024

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Patent

USING MULTI-OBJECTIVE AFFINITY MODEL FOR MINING THE RULES OF REVISITS WITHIN 72 HOURS FOR EMERGENCY DEPARTMENT PATIENTS

USING MULTI-OBJECTIVE AFFINITY MODEL FOR MINING THE RULES OF REVISITS WITHIN 72 HOURS FOR EMERGENCY DEPARTMENT PATIENTS

by Chen, Chao-Wen, Chen, Yuh-Wen, Larbani, Moussa, Li, Tzung-Hung
Published in Multiple Criteria Decision Making (01.01.2015)

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Journal Article

FLEXIBLE CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CHIP ON FILM STRUCTURE

FLEXIBLE CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING CHIP ON FILM STRUCTURE

by WU, CHENG-HUNG, LAI, KUEI-YU, TAI, WEI, CHEN, TSUNGIEN, HUNG, TZUNG-LI
Year of Publication 01.05.2024

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Patent

Flexible circuit substrate and method for manufacturing chip on film structure

Flexible circuit substrate and method for manufacturing chip on film structure

by WU, CHENG-HUNG, LAI, KUEI-YU, TAI, WEI, CHEN, TSUNGIEN, HUNG, TZUNG-LI
Year of Publication 01.04.2024

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Patent

Chip carrier and chip package structure thereof

Chip carrier and chip package structure thereof

by CHEN, TSUNG-LUNG, YANG, PING-MAO, HUNG, TZUNG-LI
Year of Publication 21.12.2007

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Patent

Flexible substrate for package

Flexible substrate for package

by HUANG, MING-O, LI, MING-HSUN, HUNG, TZUNG-LI, CHEN, PIANG
Year of Publication 11.04.2006

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Patent

Tape structure for packaging

Tape structure for packaging

by HUNG, TZUNG LI, LI, MING HSUN
Year of Publication 01.12.2008

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Patent

Semiconductor chip encapsulation structure with passive device

Semiconductor chip encapsulation structure with passive device

by TSENG, CHENG-LAN, LEE, SHUIING, FANG, HUIIN, HUNG, TZUNG-LI, WANG, CHINN
Year of Publication 11.09.2002

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Patent

Semiconductor packaging substrate for lessening deformation

Semiconductor packaging substrate for lessening deformation

by LI, MING-HSUN, HUNG, TZUNG-LI
Year of Publication 16.06.2008

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Patent

Tape structure for packaging

Tape structure for packaging

by LI, MING-HSUN, HUNG, TZUNG-LI
Year of Publication 16.02.2008

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Patent

Carrier film having staggered bends of leads and semiconductor package utilizing the film

Carrier film having staggered bends of leads and semiconductor package utilizing the film

by HUNG, TZUNG LI, LI, MING HSUN, LIU, MEN SHEW
Year of Publication 01.11.2010

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Patent

Carrier film having staggered bends of leads and semiconductor package utilizing the film

Carrier film having staggered bends of leads and semiconductor package utilizing the film

by LI, MING-HSUN, LIU, MEN-SHEW, HUNG, TZUNG-LI
Year of Publication 16.07.2008

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Patent

Carrier film to prevent cracking at bends of leads and semiconductor package utilizing the film

Carrier film to prevent cracking at bends of leads and semiconductor package utilizing the film

by LI, MING-HSUN, LIU, MEN-SHEW, HUNG, TZUNG-LI
Year of Publication 16.07.2008

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Patent

Substrate for chip on film packages

Substrate for chip on film packages

by LI, MING-HSUN, LIU, MEN-SHEW, HUNG, TZUNG-LI
Year of Publication 16.05.2008

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Patent

Flexible substrate for package

Flexible substrate for package

by HUNG, TZUNG LI, CHEN, PI CHANG, LEE, MING HSUN, HUANG, MIN O
Year of Publication 11.04.2008

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Patent

Chip carrier and chip package structure thereof

Chip carrier and chip package structure thereof

by CHEN, TSUNG-LUNG, YANG, PING-MAO, HUNG, TZUNG-LI
Year of Publication 16.08.2007

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Patent

Flexible substrate for package

Flexible substrate for package

by HUANG, MIN-O, HUNG, TZUNG-LI, CHEN, PIANG, LEE, MING-HSUN
Year of Publication 01.05.2007

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Patent