Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints
Song, Jenn-Ming, Huang, Bo-Chang, Tarng, David, Hung, Chih-Pin, Yasuda, Kiyokazu
Published in Nanomaterials (Basel, Switzerland) (25.07.2020)
Published in Nanomaterials (Basel, Switzerland) (25.07.2020)
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Journal Article
Enhanced Cu-to-Cu direct bonding by controlling surface physical properties
Chiang, Po-Hao, Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Hung, Chih-Pin
Published in Japanese Journal of Applied Physics (01.03.2017)
Published in Japanese Journal of Applied Physics (01.03.2017)
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Journal Article
Very Compact Stacked LC Resonator-Based Bandpass Filters With a Novel Approach to Tune the Transmission Zeros
CHEN, Chien-Hsun, HUANG, Chien-Hsiang, HOMG, Tzyy-Sheng, WU, Sung-Mao, LI, Jian-Yu, CHEN, Cheng-Chung, CHIU, Chi-Tsung, HUNG, Chih-Pin
Published in IEEE microwave and wireless components letters (01.05.2009)
Published in IEEE microwave and wireless components letters (01.05.2009)
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Journal Article
Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging
Song, Jenn-Ming, Liang, Sin-Yong, Xie, Zong-Yu, Chiang, Po-Hao, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin, Lin, Jing-Yuan
Published in Sensors and materials (01.01.2018)
Published in Sensors and materials (01.01.2018)
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Journal Article
Optimum Design of Transformer-Type Marchand Balun Using Scalable Integrated Passive Device Technology
HUANG, Chien-Hsiang, HORNG, Tzyy-Sheng, WANG, Chen-Chao, CHIU, Chi-Tsung, HUNG, Chih-Pin
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
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Journal Article
A Novel Channel Characteristics Estimation Methodology for High-Speed SerDes Interface on Flip-Chip Ball Grid Array Packages
Ho, Cheng-Yu, Cheng, Hung-Hsiang, Pan, Po-Chih, Wang, Chen-Chao, Hung, Chih-Pin
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2015)
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Journal Article
Effect of flip-chip ball grid array structure on capillary underfill flow
Hung, Hao-Hsi, Cheng, Yu-Chi, Hwang, Sheng-Jye, Chang, Hui-Jing, Huang, Bing-Yuan, Huang, Hung-Hsien, Chen, Dao-Long, Wang, Chen-Chao, Hung, Chih-Pin
Published in Results in engineering (01.09.2024)
Published in Results in engineering (01.09.2024)
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Journal Article
Creative Design and Structure Applied to Chiplets Packaging
Wang, Chen-Chao, Huang, Chih-Yi, Kuo, Hung-Chun, Jhong, Ming-Fong, Chu, Fu-Chen, Lai, Chung-Hung, Huang, Hung-Hsien, Hung, Chih-Pin
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Very compact transformer-coupled balun-integrated bandpass filter using integrated passive device technology on glass substrate
Chien-Hsun Chen, Chien-Hsiang Huang, Tzyy-Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, Chih-Pin Hung, Jian-Yu Li, Cheng-Chung Chen
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
Published in 2010 IEEE MTT-S International Microwave Symposium (01.05.2010)
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Conference Proceeding
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: Flip-chip versus wire-bond
Fu-Yi Han, Kung-Chung Lu, Tzyy-Sheng Horng, Jenshan Lin, Hung-Hsiang Cheng, Chi-Tsung Chiu, Chih-Pin Hung
Published in 2009 IEEE MTT-S International Microwave Symposium Digest (01.06.2009)
Published in 2009 IEEE MTT-S International Microwave Symposium Digest (01.06.2009)
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Conference Proceeding
Characterization of Dual Side Molding SiP Module
Jin-Yuan Lai, Tang-Yuan Chen, Ming-Han Wang, Meng-Kai Shih, Tarng, David, Chih-Pin Hung
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
TSV technology for 2.5D IC solution
Meng-Jen Wang, Chang-Ying Hung, Chin-Li Kao, Pao-Nan Lee, Chi-Han Chen, Chih-Pin Hung, Ho-Ming Tong
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
High Thermal Performance Package with Anisotropic Thermal Conductive Material
Hu, Ian, Jia-Rung Ho, Jin-Feng Yang, Meng-Kai Shih, Tarng, David, Chih-Pin Hung
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models
Dao-Long Chen, Tz-Cheng Chiu, Shu-Hua Lee, Po-Hsien Sung, Meng-Kai Shih, Tarng, David, Chih-Pin Hung
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
Ying-Ta Chiu, Tzu-Hsing Chiang, Ping-Feng Yang, Huang, Louie, Chih-Pin Hung, Uegaki, Shoji, Kwang-Lung Lin
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding