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Dynamic Bonding Gap Control and Tool for Wafer Bonding
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Year of Publication 24.02.2022
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Method for Patterning a Lanthanum Containing Layer
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Year of Publication 24.02.2022
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Year of Publication 24.02.2022
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Sacrificial layer for semiconductor process
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Year of Publication 22.02.2022
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Year of Publication 22.02.2022
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Wafer Bonding Apparatus and Method
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Year of Publication 12.01.2023
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Year of Publication 12.01.2023
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GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE
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Year of Publication 30.11.2023
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Laser De-Bonding Carriers and Composite Carriers Thereof
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Semiconductor Devices and Methods of Manufacture
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SEMICONDUCTOR PROCESSING TOOL AND METHOD OF USING AN EMBEDDED CHAMBER
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Year of Publication 22.12.2022
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Process for making multi-gate transistors and resulting structures
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Year of Publication 20.12.2022
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WARM WAFER AFTER ION CRYO-IMPLANTATION
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