Investigation on Ultralow Turn-off Losses Phenomenon for SiC MOSFETs With Improved Switching Model
Xie, Yue, Chen, Cai, Yan, Yiyang, Huang, Zhizhao, Kang, Yong
Published in IEEE transactions on power electronics (01.08.2021)
Published in IEEE transactions on power electronics (01.08.2021)
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Journal Article
Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure
Chen, Cai, Huang, Zhizhao, Chen, Lichuan, Tan, Yifan, Kang, Yong, Luo, Fang
Published in IEEE transactions on power electronics (01.06.2019)
Published in IEEE transactions on power electronics (01.06.2019)
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Journal Article
A novel low inductive 3D SiC power module based on hybrid packaging and integration method
Zhizhao Huang, Yuxiong Li, Lichuan Chen, Yifan Tan, Cai Chen, Yong Kang, Fang Luo
Published in 2017 IEEE Energy Conversion Congress and Exposition (ECCE) (01.10.2017)
Published in 2017 IEEE Energy Conversion Congress and Exposition (ECCE) (01.10.2017)
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Conference Proceeding
Parasitic Capacitance Modeling of Copper-Foiled Medium-Voltage Filter Inductors Considering Fringe Electrical Field
Zhao, Hongbo, Huang, Zhizhao, Dalal, Dipen Narendra, Jorgensen, Jannick Kjaer, Jorgensen, Asger Bjorn, Wang, Xiongfei, Munk-Nielsen, Stig
Published in IEEE transactions on power electronics (01.07.2021)
Published in IEEE transactions on power electronics (01.07.2021)
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Journal Article
High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-Based High Frequency Converter
Xie, Yue, Chen, Cai, Huang, Zhizhao, Liu, Teng, Kang, Yong, Luo, Fang
Published in IEEE journal of emerging and selected topics in power electronics (01.09.2019)
Published in IEEE journal of emerging and selected topics in power electronics (01.09.2019)
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Journal Article
A high power density and high efficiency three phase inverter based on a hybrid 3D SiC packaging power module
Liu, Teng, Huang, Zhizhao, Tan, Yifan, Chen, Cai, Zou, Kaifeng, Peng, Han, Kang, Yong, Luo, Fang
Published in 2018 IEEE Energy Conversion Congress and Exposition (ECCE) (01.09.2018)
Published in 2018 IEEE Energy Conversion Congress and Exposition (ECCE) (01.09.2018)
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Conference Proceeding
Using ultra-low parasitic hybrid packaging method to reduce high frequency EMI noise for SiC power module
Yue Xie, Yuxiong Li, Zhizhao Huang, Teng Liu, Yi Zhang, Yifan Tan, Cai Chen, Yong Kang
Published in 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) (01.10.2017)
Published in 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) (01.10.2017)
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Conference Proceeding
A 900A High Power Density and Low Inductive Full SiC Power Module for High Temperature Applications based on 900V SiC MOSFETs
Zhang, Chi, Huang, Zhizhao, Chen, Cai, Liu, Xinmin, Luo, Fang, Kang, Yong
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
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Conference Proceeding