PGE2 production is suppressed by chemically-synthesized Δ7-eicosatrienoic acid in macrophages through the competitive inhibition of COX-2
Huang, Wen-Cheng, Tsai, Po-Jung, Huang, Yu-Lung, Chen, Sung-Nien, Chuang, Lu-Te
Published in Food and chemical toxicology (01.04.2014)
Published in Food and chemical toxicology (01.04.2014)
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Journal Article
Development of Mechanical Locking Micro-Anchor Structures for aQFN Package Application
Yu-Lung Huang, Ajayan, Mano, Bao-Hui Chang Chien, Wei-Chih Lin
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Challenges of large Fan out multi-chip module and fine Cu line space
Lung Huang, Yu, Key Chung, C., Lin, C. F., Hua LU, Guan, Hung Tseng, Ching, Da Chang, Hong, Hsun Hsu, Chih, Xu, Bruce
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
PGE2 production is suppressed by chemically-synthesized Delta 7-eicosatrienoic acid in macrophages through the competitive inhibition of COX-2
Huang, Wen-Cheng, Tsai, Po-Jung, Huang, Yu-Lung, Chen, Sung-Nien, Chuang, Lu-Te
Published in Food and chemical toxicology (01.04.2014)
Published in Food and chemical toxicology (01.04.2014)
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Journal Article
The Study of Packaging Substrate Effect in FCBGA by Laser Assisted Bonding
Huang, Yu Lung, Huang, Joe, Huang, C. M., Yu, Kuo Haw, Luo, Tank, Hong, Wilson, Ren, Taishin
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
ELECTRONIC PACKAGE
CHIANG, Men-Yeh, WANG, Hung-Kai, HUANG, Yu-Lung, JIANG, Yih-Jenn, JIANG, Don-Son
Year of Publication 11.07.2024
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Year of Publication 11.07.2024
Patent
ELECTRONIC PACKAGE
CHIANG, Men-Yeh, WANG, Hung-Kai, HUANG, Yu-Lung, JIANG, Yih-Jenn, JIANG, Don-Son
Year of Publication 25.04.2024
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Year of Publication 25.04.2024
Patent
Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
Huang, Yu Lung, Chung, C. Key, Lin, C.F., Yu, Kuo Haw, Lin, Rung Jeng, Hong, Wilson
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Lidless and lidded Flip Chip Packages for Advanced Applications
Refai-Ahmed, Gamal, Wang, Huayan, Ramalingam, Suresh, Karunakaran, Nagadeven, Pan, Ke, Park, SB, Soundarajan, Alegesen, Kanaran, Sreedharan Kelappen, Chung, C. Key, Huang, Yu Lung
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding