Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces
WU, Pei-Lin, HUANG, Meng-Kuang, CHIAPYNG LEE, TZAN, Shyh-Rong
Published in Journal of electronic materials (01.03.2004)
Published in Journal of electronic materials (01.03.2004)
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Journal Article
Interfacial reactions in the Sn– xBi/Au couples
Yen, Yee-Wen, Liou, Wei-Kai, Chen, Chao-Ming, Lin, Cheng-Kuan, Huang, Meng-Kuang
Published in Materials chemistry and physics (15.07.2011)
Published in Materials chemistry and physics (15.07.2011)
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Journal Article
Phase equilibria of the Sn-Bi-Cu ternary system in advanced microelectronic packaging
Yee-Wen Yen, Hsien-Ming Hsiao, Gu-Jhong Jhang, Han-Wei Shi, Meng-Kuang Huang
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
Effects of different printed circuit board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued small outline J leads/Sn–Pb interfaces
Huang, Meng-Kuang, Wu, Pei-Lin, Lee, Chiapyng
Published in Materials chemistry and physics (15.05.2004)
Published in Materials chemistry and physics (15.05.2004)
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Journal Article