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Info structure and method forming same

Info structure and method forming same

by Kuo, Hung-Jui, Yu, Chen-Hua, Hu, Yu-Hsiang, Wang, Po-Han
Year of Publication 30.03.2021

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Patent

POLYIMIDE COMPOSITION FOR PACKAGE STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

POLYIMIDE COMPOSITION FOR PACKAGE STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 23.05.2019

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Patent

Semiconductor Structure and Method of Forming

Semiconductor Structure and Method of Forming

by Yu, Chen-Hua, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 23.05.2019

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Patent

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chen, Wei-Chih, Wang, Po-Han
Year of Publication 11.03.2021

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Patent

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING AN INTEGRATED FAN-OUT PACKAGE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING AN INTEGRATED FAN-OUT PACKAGE

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 09.05.2019

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Patent

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Wang, Po-Han
Year of Publication 09.05.2019

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Patent

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

by Liao, Sih-Hao, Kuo, Hung-Jui, Cho, Hung-Chun, Hu, Yu-Hsiang, Chen, Wei-Chih
Year of Publication 25.02.2021

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Patent

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

by Liao, Sih-Hao, Kuo, Hung-Jui, Cho, Hung-Chun, Hu, Yu-Hsiang, Chen, Wei-Chih
Year of Publication 25.02.2021

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Patent

STACKED VIA STRUCTURE AND METHOD OF FABRICATING THE SAME

STACKED VIA STRUCTURE AND METHOD OF FABRICATING THE SAME

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Wang, Po-Han
Year of Publication 02.05.2019

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Patent

SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 02.05.2019

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Patent

Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages

Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 30.04.2019

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Patent

Semicondcutor device package and method of forming semicondcutor device package

Semicondcutor device package and method of forming semicondcutor device package

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 30.04.2019

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Patent

INTEGRATED FAN-OUT PACKAGE

INTEGRATED FAN-OUT PACKAGE

by Liao, Sih-Hao, Tu, Meng-Che, Kuo, Hung-Jui, Hu, Yu-Hsiang
Year of Publication 21.01.2021

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Patent

APPARATUS, SYSTEM AND METHOD

APPARATUS, SYSTEM AND METHOD

by Kuo, Hung-Jui, Yu, Chen-Hua, Hu, Yu-Hsiang, Wang, Po-Han
Year of Publication 07.01.2021

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Patent

Optical interconnect structure, package structure and fabricating method thereof

Optical interconnect structure, package structure and fabricating method thereof

by Kuo, Hung-Yi, Weng, Chung-Ming, Yu, Chen-Hua, Hsieh, Cheng-Chieh, Yu, Tsung-Yuan, Hu, Yu-Hsiang, Jou, Chewn-Pu, Lin, Hua-Kuei, Kuo, Feng-Wei, Liu, Chung-Shi, Tsai, Hao-Yi
Year of Publication 26.09.2023

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Patent

Air Channel Formation in Packaging Process

Air Channel Formation in Packaging Process

by Lin, Chiang, Lee, Wan-Yu, Tseng, Hua-Wei, Huang, Li-Hsien, Hu, Yu-Hsiang, Lin, Yueh-Ting
Year of Publication 25.11.2021

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Patent

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME

by Liao, Sih-Hao, Kuo, Hung-Jui, Hou, Hao-Cheng, Hu, Yu-Hsiang, Wang, Tsung-Ding, Chen, Wei-Chih, Lee, Chien-Hsun, Liu, Chung-Shi, Cheng, Jung-Wei
Year of Publication 13.10.2022

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Patent

Package structure, semiconductor device and method of fabricating the same

Package structure, semiconductor device and method of fabricating the same

by Liao, Sih-Hao, Kuo, Hung-Jui, Hu, Yu-Hsiang, Chen, Wei-Chih, Wang, Po-Han
Year of Publication 01.12.2020

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Patent

Semiconductor Device and Method

Semiconductor Device and Method

by Kuo, Hung-Jui, Hu, Yu-Hsiang, Liu, Zi-Jheng
Year of Publication 31.01.2019

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Patent

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

by Liao, Sih-Hao, Kuo, Hung-Jui, Cho, Hung-Chun, Hu, Yu-Hsiang, Chen, Wei-Chih
Year of Publication 10.11.2020

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Patent

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