UV-Curable Anisotropic Conductive Paste (ACP) for RFID Tag Packaging
Cao, Huixia, Li, Jingtian, Wang, Yong, Xu, Yadong, Lu, Xi, Hu, Yougen, Sun, Rong
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Fabrication of Graphite/Hydroxyethyl Cellulose (HEC)/Silicone Gel Composites with Aligned Structure for Electromagnetic Interference Shielding and Thermal Management
Wang, Jianda, Zhao, Zhijie, Zhang, Zhen, Lin, Zhiqiang, Hu, Yougen
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Silver@Expanded Microspheres/Silicone Conductive Composites with Ultra-low Compression Stress for Electromagnetic Interference Shielding in Electronic Packaging
Duan, Yingjie, Zhang, Luhui, Wang, Yong, Xu, Yadong, Sun, Rong, Hu, Yougen
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Experimental and Computational Study of Shielding Effectiveness of Metal Grids
Lin, Zhiqiang, Liu, Xuebin, Shi, Xinrong, Hu, Yougen, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Structural Analysis of Anisotropic Conductive Film for Liquid Crystal Displays and Semiconductor Packaging Applications
Xu, Yadong, Wang, Yong, Liu, Xuebi, Lu, Xi, Lin, Zhiqiang, Wan, Yanjun, Li, Jianhui, Long, Haohui, Hu, Yougen, Sun, Rong
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Stretchable and Highly Conductive AgNPs/SBS Film with Wrinkled Ag Layer for Electromagnetic Interference Shielding
Zhao, Zeyu, Tian, Dingkun, Lin, Zhiqiang, Xu, Yadong, Hu, Yougen, Sun, Rong
Published in 2022 IEEE International Flexible Electronics Technology Conference (IFETC) (21.08.2022)
Published in 2022 IEEE International Flexible Electronics Technology Conference (IFETC) (21.08.2022)
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Conference Proceeding
Lightweight heat-expandable microspheres/multiwall carbon nanotubes composites with gradient structure for absorption-dominated electromagnetic interference shielding in electronic packages
Wei, Jianhong, Xu, Yadong, Deng, Fukang, Miao, Hua, Hu, Yougen, Sun, Rong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Vertically Aligned Natural Graphite/Thermoplastic Polyurethane Composites for Thermal Management and Electromagnetic Interference Shielding
Zhang, Zhen, Chen, Fei, Wang, Yong, Xu, Yadong, Sun, Rong, Hu, Yougen
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Graphite/Liquid Metal/Thermoplastic Polyurethane Composite Film Based on Interfacial Architectural Engineering for Synergistic Electromagnetic Interference Shielding and Thermal Management
Liu, Xuebin, Chen, Fei, Xu, Yadong, Wan, Yanjun, Hu, Yougen, Sun, Rong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Research on a novel and ultra-thin SMT gasket of compressible conductive silicone/tinned copper foil composites for PCBA
He, Jinming, Lin, Zhiqiang, Wang, Yong, Xu, Yadong, Hu, Yougen, Sun, Rong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Metalized Polyimide Fibrous Film via Metal-Organic Decomposition Method for Electromagnetic Interference (EMI) Shielding
Zhao, Zhijie, Wang, Jianda, Zhang, Xiaofei, Lin, Zhiqiang, Hu, Yougen, Sun, Rong
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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Conference Proceeding
Lightweight and Compressible Expandable Polymer Microspheres/Silver Flakes Composites for High-efficiency Electromagnetic Interference Shielding
Wei, Jianhong, Xu, Yadong, Lin, Zhiqiang, Lei, Zuomin, Fu, Xianzhu, Hu, Yougen, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Fabrication of Soft Conductive Microspheres and Their Application in Electromagnetic Interference Shielding Sheets
Zhang, Luhui, Lei, Zuomin, He, Jinming, Zhu, Deliang, Hu, Yougen, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
A Comparative Study on the Influences of Various Nickel Powders on the EMI Shielding Performance of Conductive Polymer Composites
Wang, Yong, Tian, Dingkun, Xu, Yadong, Zhang, Baotan, Zhao, Tao, Hu, Yougen, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Investigation into Electrical Conductivity and Electromagnetic Interference Shielding Performance of Ag/TPU Hybrids Filled with Various Silver Fillers
Zhang, Haorui, Lin, Zhiqiang, Zhao, Tao, Zhu, Pengli, Hu, Yougen, Rong, Sun
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
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Conference Proceeding
Stretchable and Printable Conductive Polymer Composites for Electromagnetic Interference (EMI) Shielding Meshes
Liu, Xuebin, Lei, Zuomin, Lin, Zhiqiang, Hu, Yougen, Zhu, Pengli, Sun, Rong
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
Fabrication of lightweight CMF/RGO/Ag nanocomposite foam via a simple pyrolysis method for highly effective electromagnetic interference (EMI) shielding
Shen, Youkang, Chen, Fei, Zhang, Luhui, Zhang, Haorui, Xu, Yadong, Zeng, Xierong, Hu, Yougen, Sun, Rong
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
A conductive composite foam based on poly(styrene-butadiene-styrene)/carbon nanotube (SBS/CNT) for electromagnetic interference shielding
Tian, Dingkun, Wang, Yong, Xu, Yadong, Zhang, Lin, Hu, Yougen, Deng, Fei, Sun, Rong
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01.08.2020)
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Conference Proceeding
Three Dimensional Copper Foam-Filled Elastic Conductive Composites with Simultaneously Enhanced Mechanical, Electrical, Thermal and Electromagnetic Interference (EMI) Shielding Properties
Lu, Tan, Gu, Han, Hu, Yougen, Zhao, Tao, Zhu, Pengli, Sun, Rong, Wong, Ching-Ping
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding