Bump Design Optimization for Copper Pillar FCBGA Package
Tsung-Shu Lin, Chen, K.M., Yen-chang Hu, Yih-jenn Jiang
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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Conference Proceeding
Fan-out interconnect structure and method for forming same
Yu, Chen-Hua, Lii, Mirng-Ji, Chen, Chen-Shien, Hsiao, Ching-Wen, Hu, Yen-Chang, Lin, Chih-Wei, Hwang, Chien Ling, Liu, Chung-Shi
Year of Publication 28.09.2021
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Year of Publication 28.09.2021
Patent
Fan-Out Interconnect Structure and Method for Forming Same
Yu, Chen-Hua, Lii, Mirng-Ji, Chen, Chen-Shien, Hsiao, Ching-Wen, Hu, Yen-Chang, Lin, Chih-Wei, Hwang, Chien Ling, Liu, Chung-Shi
Year of Publication 15.10.2020
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Year of Publication 15.10.2020
Patent
Fan-out interconnect structure and method for forming same
Yu, Chen-Hua, Lii, Mirng-Ji, Chen, Chen-Shien, Hsiao, Ching-Wen, Hu, Yen-Chang, Lin, Chih-Wei, Hwang, Chien Ling, Liu, Chung-Shi
Year of Publication 30.06.2020
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Year of Publication 30.06.2020
Patent
Packaging with interposer frame
Cheng, Ming-Da, Huang, Hui-Min, Chen, Chen-Shien, Hu, Yen-Chang, Lin, Chih-Wei, Liu, Chung-Shi
Year of Publication 05.06.2018
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Year of Publication 05.06.2018
Patent
Fractionated evaluation of immunohistochemical hormone receptor expression enhances prognostic prediction in breast cancer patients treated with tamoxifen as adjuvant therapy
Lin, Ching-hung, Lien, Huang-chun, Hu, Fu-chang, Lu, Yen-shen, Kuo, Sung-hsin, Wu, Ling-chu, You, San-lin, Cheng, Ann-lii, Chang, King-jen, Huang, Chiun-sheng
Published in Journal of Zhejiang University. B. Science (2010)
Published in Journal of Zhejiang University. B. Science (2010)
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Journal Article
METHOD OF PACKAGING A SEMICONDUCTOR DIE
HUANG, Hui-Min, CHEN, Chen-Shien, LIN, Chih-Wei, LIU, Chung-Shi, HU, Yen-Chang, CHENG, Ming-Da
Year of Publication 04.10.2018
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Year of Publication 04.10.2018
Patent
Packages, methods of packaging a device and package on package devices
KUO, TIN HAO, CHEN, CHIH HUA, CHEN, CHEN SHIEN, HU, YEN CHANG, HSIAO, CHING WEN
Year of Publication 11.04.2016
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Year of Publication 11.04.2016
Patent