by Hu, Heming, Kaizu, Yutaka, Huang, Jingjing, Furuhashi, Kenichi, Zhang, Hongduo, Li, Ming, Imou, Kenji
Published in Frontiers in plant science (07.07.2022)

by Xu, Shoulin, Hu, Heming, He, Bin
Published in Applied bionics and biomechanics (01.01.2019)

by Ma, Xiaoyue, Hu, Heming, Liu, Shiping, Dong, Runyu, Fang, Qing, Chen, Hua
Published in Frontiers in physics (03.10.2022)

by Liu, Shiping, Hu, Heming, Ma, Xiaoyue, Dong, Runyu, Fang, Qing, Chen, Hua
Published in Frontiers in physics (07.10.2022)

by Huang, Jingjing, Zou, Ting, Hu, Heming, Xiao, Xu, Wang, Zhiwei, Li, Ming, Dai, Sihui
Published in Applied sciences (01.12.2022)

by Hu, Heming, Liu, Shiping, Ma, Xiaoyue, Dong, Runyu, Chen, Hua, Fang, Qing
Published in Frontiers in physics (21.10.2022)

by Feng, Song, Hu, Xiangjian, Feng, Lulu, Wang, Di, Chen, Menglin, Liu, Yong, Hu, Heming, Jia, Lianxi
Published in Frontiers in physics (07.11.2022)

by Yuan, Liu, Heming, Hu
Published in 2021 International Wireless Communications and Mobile Computing (IWCMC) (28.06.2021)

by Hu, Heming, Fang, Qing, Wang, Shuxiao, Zhang, Xindan, Ma, Xiaoyue, Gu, Miaomiao, Jia, Lianxi, Chen, Hua
Published in Optics communications (01.12.2021)

by Shi, Jifeng, Sun, Mingxuan, Hu, Heming
Published in Materials research express (01.03.2019)

by Li, XueTong, Qu, Huan, Li, YingZhi, Liu, XiaoBin, Xie, QiJie, Wang, WeiPeng, Chen, BaiSong, Hu, HeMing, ZHi, ZiHao, Li, Jie, Na, QuanXin, Lo, GuoQiang, Li, XueYan, Wang, Lei, Hu, XiaoLong, Song, JunFeng
Published in IEEE electron device letters (01.10.2024)

by Chen, Baisong, Li, Yingzhi, Xie, Qijie, Na, Quanxin, Tao, Min, Wang, Ziming, Zhi, Zihao, Hu, Heming, Li, Xuetong, Qu, Huan, He, Yafang, Hu, Xiaolong, Lo, Guoqiang, Song, Junfeng
Published in Laser & photonics reviews (01.10.2024)

by Liu, Xiaobin, Li, Xuetong, Li, Yingzhi, Zhi, Zihao, Chen, Baisong, Hu, Heming, Xie, Qijie, Na, Quanxin, Li, Xueyan, Guo, Pengfei, Gao, Fengli, Lo, GuoQiang, Kang, BoNan, Song, Junfeng
Published in IEEE electron device letters (01.02.2023)

by Hu, Heming, Kaizu, Yutaka, Huang, Jingjing, Furuhashi, Kenichi, Zhang, Hongduo, Xiao, Xu, Li, Ming, Imou, Kenji
Published in International journal of agricultural and biological engineering (01.09.2022)

by Hu, Heming, Kaizu, Yutaka, Zhang, Hongduo, Xu, Yongwei, Imou, Kenji, Li, Ming, Huang, Jingjing, Dai, Sihui
Published in International journal of agricultural and biological engineering (01.11.2022)

by Shi, Jifeng, Sun, Mingxuan, Hu, Heming
Published in Materials research express (13.12.2018)

by Huang, Jingjing, Dai, Sihui, Hu, Heming, Zhang, Hongduo, Xie, Jingxin, Li, Ming
Published in International journal of agricultural and biological engineering (01.07.2021)

by Huang, Jingjing, Zhang, Hongduo, Xiao, Xu, Huang, Jingqi, Xie, Jingxin, Zhang, Liang, Hu, Heming, Dai, Sihui, Li, Ming, Xu, Yongwei
Published in International journal of agricultural and biological engineering (01.09.2021)

by Laixiao Nie, Dandan Zheng, Tao Zhang, Xiaoli Guo, Heming Hu
Published in 2012 2nd International Conference on Consumer Electronics, Communications and Networks (CECNet) (01.04.2012)

by Song, JianJun, Zhang, HeMing, Hu, HuiYong, Wang, XiaoYan, Wang, GuanYu
Published in Science China. Physics, mechanics & astronomy (01.08.2012)