Application of AI in in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis
Huo, Jian, Yu, Yan, Lin, Wei, Hu, Anmin, Wu, Chaoran
Published in Journal of medical Internet research (12.04.2024)
Published in Journal of medical Internet research (12.04.2024)
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Journal Article
Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition
Hang, Tao, Hu, Anmin, Ling, Huiqin, Li, Ming, Mao, Dali
Published in Applied surface science (01.02.2010)
Published in Applied surface science (01.02.2010)
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Journal Article
Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding
Xie, Jiunan, Hu, Hua, Chen, Peixin, Lei, Han, Hu, Anmin, Wu, Yunwen, Li, Ming
Published in Electronic materials letters (01.05.2024)
Published in Electronic materials letters (01.05.2024)
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Journal Article
A facile process for preparing superhydrophobic nickel films with stearic acid
Chen, Zhuo, Tian, Feifei, Hu, Anmin, Li, Ming
Published in Surface & coatings technology (01.09.2013)
Published in Surface & coatings technology (01.09.2013)
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Conference Proceeding
Journal Article
Effects of W contents on the solid-state interfacial reactions of Sn/Co-W
Chen, Shuhui, Yang, Chenlin, Tan, Lingyue, Xia, Yuanyuan, Hu, Anmin, Ling, Huiqin, Wu, Yunwen, Li, Ming, Hang, Tao
Published in Journal of materials science (2022)
Published in Journal of materials science (2022)
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Journal Article
Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps
Yang, Chenlin, Ren, Siru, Zhang, Xundi, Hu, Anmin, Li, Ming, Gao, Liming, Ling, Huiqin, Hang, Tao
Published in Materials characterization (01.01.2020)
Published in Materials characterization (01.01.2020)
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Journal Article
Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation
Ren, Siru, Guo, Yukun, Ju, Longlong, Xiao, Han, Hu, Anmin, Li, Ming
Published in Journal of materials science (01.05.2019)
Published in Journal of materials science (01.05.2019)
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Journal Article
Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders
Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (30.10.2012)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (30.10.2012)
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Journal Article
Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology
Sun, Yaqian, Wang, Jing, Zhang, Xundi, Yang, Chenlin, Hu, Anmin, Hang, Tao, Wu, Yunwen, Ling, Huiqin, Li, Ming
Published in Electronic materials letters (01.11.2021)
Published in Electronic materials letters (01.11.2021)
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Journal Article
Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst
Hu, Anmin, Li, Ming, Chang, Chengkang, Mao, Dali
Published in Journal of molecular catalysis. A, Chemical (18.04.2007)
Published in Journal of molecular catalysis. A, Chemical (18.04.2007)
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Journal Article
Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing
Zhang, Xundi, Yang, Chenlin, Zhang, Yumei, Hu, Anmin, Li, Ming, Gao, Liming, Ling, Huiqin, Hang, Tao
Published in Electronic materials letters (01.07.2020)
Published in Electronic materials letters (01.07.2020)
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Journal Article