Solid-state bonding using metallic cone layer for interconnection
Ming Li, Anmin Hu, Zhuo Chen, Qin Lu, Wenjing Zhang, Suga, T., Yinghui Wang, Higurashi, E., Fujino, M.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Get full text
Conference Proceeding
Study on properties of low-Ag content Sn-Ag-Zn lead-free solders
Tingbi Luo, Xi Chen, Jing Hu, Anmin Hu, Ming Li
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Get full text
Conference Proceeding
Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder
Tingbi Luo, Anmin Hu, Ming Li, Dali Mao
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Get full text
Conference Proceeding
Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions
Jing Hu, Xi Chen, Anmin Hu, Ming Li, Dali Mao
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Get full text
Conference Proceeding
Effects of propofol, etomidate and ethanol on GPCR mRNA expression in Daphnia pulex
Hu, Anmin, Dong, Changhong, Zuo, Yunxia, Li, Guohua
Published in Sheng wu yi xue gong cheng xue za zhi (01.08.2014)
Get more information
Published in Sheng wu yi xue gong cheng xue za zhi (01.08.2014)
Journal Article
Effects of propofol, etomidate and ethanol on GPCR mRNA expression in Daphnia pulex
Hu, Anmin, Dong, Changhong, Zuo, Yunxia, Li, Guohua
Published in Sheng wu yi xue gong cheng xue za zhi (01.08.2014)
Get more information
Published in Sheng wu yi xue gong cheng xue za zhi (01.08.2014)
Journal Article
Influence of crystal orientation on the oxidation failure of copper for IC package
Jie Gao, Anmin Hu, Ming Li, Dali Mao
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Get full text
Conference Proceeding
Effects of midazolam, pentobarbital and ketamine on the mRNA expression of ion channels in a model organism Daphnia pulex
Dong, Changhong, Hu, Anmin, Ni, Yang, Zuo, Yunxia, Li, Guo Hua
Published in BMC anesthesiology (18.10.2013)
Published in BMC anesthesiology (18.10.2013)
Get full text
Journal Article
Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate
Xi Chen, Anmin Hu, Ming Li, Dali Mao
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Get full text
Conference Proceeding
Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection
Chen, Zhuo, Luo, Tingbi, Hang, Tao, Li, Ming, Hu, Anmin
Published in ECS solid state letters (01.01.2012)
Published in ECS solid state letters (01.01.2012)
Get full text
Journal Article
Fine pitch and high density Sn bump fabrication
Jinglin Bi, Jin Jiang, Anmin Hu, Ming Li, Dali Mao, Suga, T.
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Get full text
Conference Proceeding
Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder
Qi Li, Anmin Hu, Ming Li, Dali Mao
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Get full text
Conference Proceeding
The influence of pre-heat treatment on peeling resistance of oxide film of copper alloy lead frames
Jiwang Mao, Xi Chen, Anmin Hu, Ming Li, Dali Mao
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Get full text
Conference Proceeding
Adaptive Indoor Localization with Wi-Fi Based on Transfer Learning
Hu, Anmin, Zhang, Lijun
Published in 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) (01.05.2019)
Published in 2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) (01.05.2019)
Get full text
Conference Proceeding
Electroless plating of copper nano-coned array for high reliability packaging
Zhongwen Pan, Anmin Hu, Tao Hang, Yingying Duan, Ming Li, Dali Mao
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Get full text
Conference Proceeding
Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder
Huan Wang, Anmin Hu, Chengkang Chang Ming Li, Dali Mao
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Get full text
Conference Proceeding
Oxidation failure of Lead Frame Copper alloys with Surface Electroplated Pure Cu
Xi Chen, Anmin Hu, Ming Li, Hong Shen, Dali Mao
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Get full text
Conference Proceeding