Semiconductor package with a bridge interposer
Zhao Sam Ziqun, Vorenkamp Pieter, Hu Kevin Kunzhong, Khan Rezaur Rahman, Chen Xiangdong, Karikalan Sampath K
Year of Publication 30.08.2016
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Year of Publication 30.08.2016
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Semiconductor interposer having a cavity for intra-interposer die
Zhao Sam Ziqun, Vorenkamp Pieter, Hu Kevin Kunzhong, Khan Rezaur Rahman, Karikalan Sampath K. V, Chen Xiangdong
Year of Publication 17.01.2017
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Year of Publication 17.01.2017
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STACKED PACKAGING USING RECONSTITUTED WAFERS
Hu, Kevin Kunzhong, Karikalan, Sampath K.V. KV, Chen, Xiangdong, Vorenkamp, Pieter, Khan, Rezaur Rahman, Zhao, Sam Ziqun
Year of Publication 30.12.2016
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Year of Publication 30.12.2016
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Semiconductor packaging element
SAM ZIQUN ZHAO, SAMPATH K. V. KARIKALAN, KEVIN KUNZHONG HU, REZAUR RAHMAN KHAN, PIETER VORENKAMP, XIANGDONG CHEN
Year of Publication 31.07.2013
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Year of Publication 31.07.2013
Patent