Experimental Investigation on the Performance of a Compressed-Air Driven Piston Engine
Huang, Chih-Yung, Hu, Cheng-Kang, Yu, Chih-Jie, Sung, Cheng-Kuo
Published in Energies (Basel) (01.03.2013)
Published in Energies (Basel) (01.03.2013)
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Journal Article
Effect of Sb2O3 Particle Size and Filling Amount on Crystallization and Mechanical Properties of Sb2O3/PP Composites
Niu, Lei, Liu, Xiao Qi, Xu, Jian Lin, Chen, Zhou, Kang, Cheng Hu
Published in Materials science forum (01.06.2019)
Published in Materials science forum (01.06.2019)
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Journal Article
Thermal Decomposition Kinetics of Flame Retardant Polybutylene Terephthalate Matrix Composites
Xu, Cheng Cheng, Lin, Yong Gang, Ma, Bing Xue, Xu, Jian Lin, Chen, Zhou, Kang, Cheng Hu
Published in Materials science forum (01.06.2019)
Published in Materials science forum (01.06.2019)
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Journal Article
Design of the Hilbert fractal defected ground structure low-pass filter
Zhang Wei, Yang Wei-ming, Fang Yin-yin, Hu Cheng-kang, Zhu Xing-yu, Ma ge
Published in 2014 IEEE International Conference on Communiction Problem-solving (01.12.2014)
Published in 2014 IEEE International Conference on Communiction Problem-solving (01.12.2014)
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Conference Proceeding
Apparatus and method for inspecting wafer carriers
Chuang, Sheng-Hsiang, Pai, Jiun-Rong, Kuo, Shou-Wen, Liu, Hsu-Shui, Hu, Cheng-Kang
Year of Publication 12.03.2024
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Year of Publication 12.03.2024
Patent
WAFER TRANSFER SYSTEM AND A METHOD FOR TRANSPORTING WAFERS
Lin, Chieh-Chun, Wu, Ren-Hau, Liao, Jia-Hong, Hu, Cheng-Kang, Liu, Cheng-Yi
Year of Publication 12.10.2023
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Year of Publication 12.10.2023
Patent
HUMIDITY CONTROL DEVICE FOR EQUIPMENT FRONT END MODULE OF SEMICONDUCTOR PROCESSING OR CHARACTERIZATION TOOL
Wu, Cheng-Lung, Shiu, Yi-Fam, Wu, Ren-Hau, Liu, Hsu-Shui, Hu, Cheng-Kang
Year of Publication 29.06.2023
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Year of Publication 29.06.2023
Patent
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Pai, Jiun-Rong, Tsao, Chang-Chen, YU, Cheng-Fei, Shiu, Ting-Yau, Liu, Hsu-Shui, Hu, Cheng-Kang
Year of Publication 07.09.2023
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Year of Publication 07.09.2023
Patent
Fully automated wafer debonding system and method thereof
Pai, Jiun-Rong, Tsao, Chang-Chen, Shiu, Ting-Yau, Liu, Hsu-Shui, Yu, Cheng-Fei, Hu, Cheng-Kang
Year of Publication 06.06.2023
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Year of Publication 06.06.2023
Patent
Method and system for map-free inspection of semiconductor devices
Liao, Jiao-Rou, Chuang, Sheng-Hsiang, Pai, Jiun-Rong, Kuo, Shou-Wen, Liu, Hsu-Shui, Hu, Cheng-Kang
Year of Publication 16.05.2023
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Year of Publication 16.05.2023
Patent
Topological scanning method and system
Liao, Jiao-Rou, Chuang, Sheng-Hsiang, Pai, Jiun-Rong, Kuo, Shou-Wen, Liu, Hsu-Shui, Hu, Cheng-Kang
Year of Publication 14.09.2021
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Year of Publication 14.09.2021
Patent