Search Results - "HSU, CHIA-KUEI" :: K.UTB vyhledávací portál

An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill

by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

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Fan-out wafer molding process optimization using cure-dependent viscoelastic modeling and characterizations

by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)

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Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages

by Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

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A Novel Experimental System for Characterizing Interface Delamination under Mixed-Mode Fatigue Loading

by Tz-Cheng Chiu, Wei Lu, Chi-An Hua, Chia-Kuei Hsu
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)

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Characterization methodologies for copper/polymer interfacial strength

by Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)

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HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS

by LEE YU CHEN, LIN PO YAO, YEH SHU SHEN, JENG SHIN PUU, HSU CHIA KUEI
Year of Publication 06.12.2022

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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

by LIN PO YAO, WANG CHIN HUA, YEH SHU SHEN, JENG SHIN PUU, HSU CHIA KUEI
Year of Publication 11.08.2022

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MULTI-BUMP CONNECTION TO INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

by TSAI SHANG LUN, LEE TSUNG YEN, LIN PO YAO, HSU CHIA KUEI, YEW MING CHIH
Year of Publication 09.05.2022

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PACKAGE STRUCTURE AND METHOD

by LIN PO YAO, WANG CHIN HUA, YEH SHU SHEN, YANG CHE CHIA, JENG SHIN PUU, HSU CHIA KUEI
Year of Publication 08.02.2022

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REINFORCING PACKAGE USING REINFORCING PATCHES

by LIN PO YAO, HSU FENG CHENG, JENG SHIN PUU, HSU CHIA KUEI, YEW MING CHIH, CHEN SHUO MAO
Year of Publication 30.09.2021

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

by LIN PO YAO, LAI PO CHEN, YEH SHU SHEN, JENG SHIN PUU, HSU CHIA KUEI, YEW MING CHIH
Year of Publication 08.02.2022

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FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

by LIN PO YAO, TSAI PO HAO, LIN MENG LIANG, CHUANG PO YAO, HUNG SHIH TING, JENG SHIN PUU, YEW MING CHIH, HSU CHIA KUEI
Year of Publication 13.04.2022

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FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

by LIN PO YAO, TSAI PO HAO, LIN MENG LIANG, CHUANG PO YAO, HUNG SHIH TING, JENG SHIN PUU, YEW MING CHIH, HSU CHIA KUEI
Year of Publication 08.04.2020

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Warpage Modeling and Characterization of the Cure-dependent Chemical Shrinkage and Viscoelastic Relaxation for Cured Molding Process

by Yeh, Shu-Shen, Lin, Po-Yao, Lee, Kuang-Chun, Wang, Jin-Hua, Lin, Wen-Yi, Yew, Ming-Chih, Lai, Po-Chen, Hsu, Chia-Kuei, Yang, Che-Chia, Liao, Li-Ling, Lin, Yu-Sheng, Jeng, Shin-Puu
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)

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