A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications
Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Yang, Yu-Tao, Hung, Tzu-Heng, Chen, Kuan-Neng
Published in IEEE electron device letters (01.03.2024)
Published in IEEE electron device letters (01.03.2024)
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Journal Article
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Hung, Tzu-Heng, Chen, Kuan-Neng
Published in Nanomaterials (Basel, Switzerland) (01.09.2023)
Published in Nanomaterials (Basel, Switzerland) (01.09.2023)
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Journal Article
Low Temperature Cu/SiO2 Hybrid Bonding with Metal Passivation
Liu, Demin, Chen, Po-Chi, Hsiung, Chien-Kang, Huang, Shin-Yi, Huang, Yan-Pin, Verhaverbeke, Steven, Mori, Glen, Chen, Kuan-Neng
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
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Conference Proceeding
Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure
Hsiung, Chien-Kang, Wang, Terry, Wozny, Sarah, Bernt, Marvin L, Chen, Kuan-Nang
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
폴리머 재료들의 마이크로파 프로세싱을 위한 방법들 및 장치
RAMACHANDRAN VINODH, JUPUDI ANANTHKRISHNA, OW YUEH SHENG, DENG FELIX, CHEN NUNO YEN CHU, KOH TUCK FOONG, CUI YUE, GOH CLINTON, HSIUNG CHIEN KANG
Year of Publication 17.03.2022
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Year of Publication 17.03.2022
Patent
Characterization of Pd–GaAs Schottky diodes prepared by the electroless plating technique
Chen, Huey-Ing, Hsiung, Chien-Kang, Chou, Yen-I
Published in Semiconductor science and technology (01.07.2003)
Published in Semiconductor science and technology (01.07.2003)
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Journal Article
Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration
Hong, Zhong-Jie, Liu, Demin, Hu, Han-Wen, Hsiung, Chien-Kang, Cho, Chih-I, Chen, Chih-Han, Liu, Jui-Han, Weng, Ming-Wei, Hsu, Mu-Ping, Hung, Ying-Chan, Chen, Kuan-Neng
Published in Applied surface science (01.02.2023)
Published in Applied surface science (01.02.2023)
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Journal Article