Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography
Nakamura, Naofumi, Oda, Noriaki, Soda, Eiichi, Aoyama, Hajime, Tanaka, Yuusuke, Kawamura, Daisuke, Hosoi, Nobuki, Takigawa, Yukio, Shiohara, Morio, Kondo, Seiichi, Mori, Ichiro, Saito, Shuichi
Published in Japanese Journal of Applied Physics (01.02.2011)
Published in Japanese Journal of Applied Physics (01.02.2011)
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Journal Article
Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography
Nakamura, Naofumi, Oda, Noriaki, Soda, Eiichi, Aoyama, Hajime, Tanaka, Yuusuke, Kawamura, Daisuke, Hosoi, Nobuki, Takigawa, Yukio, Shiohara, Morio, Kondo, Seiichi, Mori, Ichiro, Saito, Shuichi
Published in Japanese Journal of Applied Physics (01.02.2011)
Published in Japanese Journal of Applied Physics (01.02.2011)
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Journal Article
Development of a two-step electroplating process with a long-term stability for applying to Cu metallization of 0.1-μm generation logic ULSIs
ARITA, Koji, ITO, Nobukazu, HOSOI, Nobuki, MIYAMOTO, Hidenobu
Published in IEEE transactions on semiconductor manufacturing (01.11.2002)
Published in IEEE transactions on semiconductor manufacturing (01.11.2002)
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Conference Proceeding
Journal Article
TiW/Cu/TiW interconnection lines patterned by IR-assisted RIE
Furuya, A., Hosoi, N., Koyama, K., Ohshita, Y., Numasawa, Y.
Published in IEEE transactions on electron devices (01.12.1996)
Published in IEEE transactions on electron devices (01.12.1996)
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Journal Article
Cu / Barrier Metal Stack Film Characterization for Reliability Estimation
Ogawa, S., Ohdaira, T., Hosoi, N., Tarumi, N., Suzuki, R., Saito, S.
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding