3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Buchwalter, L.P., Sprogis, E.J., Hua Gan, Horton, R.R., Polastre, R.J., Wright, S.L., Cotte, J.M.
Published in IEEE journal of solid-state circuits (01.08.2006)
Published in IEEE journal of solid-state circuits (01.08.2006)
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Journal Article
Conference Proceeding
Three-dimensional silicon integration
Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, K, Andry, P S, Tsang, C K, Wright, S L, Dang, B, Patel, C S, Webb, B C, Maria, J, Sprogis, E J, Kang, S K, Polastre, R J, Horton, R R, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article
3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Journal Article
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Paivikki Buchwalter, L., Sprogis, E., Hua Gan, Horton, R.R., Polastre, R., Wright, S.L., Schuster, C., Baks, C., Doany, F., Rosner, J., Cordes, S.
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
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Conference Proceeding
Laser release process for very thin Si-carrier build
HORTON RAYMOND R, GOMA SHERIF A, SPROGIS EDMUND J, ANDRY PAUL STEPHEN, FARINELLI MATTHEW J, BUCHWALTER LEENA PAIVIKKI
Year of Publication 29.05.2012
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Year of Publication 29.05.2012
Patent
Laser release process for very thin Si-carrier build
Andry, Paul Stephen, Buchwalter, Leena Paivikki, Farinelli, Matthew J, Goma, Sherif A, Horton, Raymond R, Sprogis, Edmund J
Year of Publication 29.05.2012
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Year of Publication 29.05.2012
Patent
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
ANDRY PAUL S, HORTON RAYMOND R, GOMA SHERIF A, SPROGIS EDMUND J, FARINELLI MATTHEW J, BUCHWALTER LEENA P
Year of Publication 19.04.2012
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Year of Publication 19.04.2012
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Techniques for providing decoupling capacitance
Horton, Raymond R, Knickerbocker, John U, Sprogis, Edmund J, Tsang, Cornelia K
Year of Publication 07.09.2010
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Year of Publication 07.09.2010
Patent
Techniques for providing decoupling capacitance
HORTON RAYMOND R, KNICKERBOCKER JOHN U, SPROGIS EDMUND J, TSANG CORNELIA K
Year of Publication 07.09.2010
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Year of Publication 07.09.2010
Patent
Techniques for providing decoupling capacitance
Horton, Raymond R, Knickerbocker, John U, Sprogis, Edmund J, Tsang, Cornelia K
Year of Publication 22.06.2010
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Year of Publication 22.06.2010
Patent
Techniques for providing decoupling capacitance
HORTON RAYMOND R, KNICKERBOCKER JOHN U, SPROGIS EDMUND J, TSANG CORNELIA K
Year of Publication 22.06.2010
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Year of Publication 22.06.2010
Patent
MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES
BERGER, MICHAEL, PERFECTO, ERIC, D, BUCHWALTER, LEENA, P, CASEY, JON, A, JAIN, ANURAG, CANAPERI, DONALD, F, TORNELLO, JAMES, A, HORTON, RAYMOND, R
Year of Publication 05.12.2012
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Year of Publication 05.12.2012
Patent
Techniques for providing decoupling capacitance
HORTON RAYMOND R, KNICKERBOCKER JOHN U, SPROGIS EDMUND J, TSANG CORNELIA K
Year of Publication 06.04.2010
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Year of Publication 06.04.2010
Patent
Techniques for providing decoupling capacitance
Horton, Raymond R, Knickerbocker, John U, Sprogis, Edmund J, Tsang, Cornelia K
Year of Publication 06.04.2010
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Year of Publication 06.04.2010
Patent
Techniques for providing decoupling capacitance
Horton, Raymond R, Knickerbocker, John U, Sprogis, Edmund J, Tsang, Cornelia K
Year of Publication 10.02.2009
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Year of Publication 10.02.2009
Patent