Thermal and Mechanical Analysis of Embedded Liquid Cooling with Microchannel and Pin-fin Structures
Miyazawa, Risa, Mori, Hiroyuki, Horibe, Akihiro
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
Chen, Qianwen, Belyansky, Michael, Sulehria, Yasir, Horibe, Akihiro, Qin, Liqiao, Pujari, Ruturaj, Perfecto, Eric, Lie, Fee Li, Butt, Shahid, Polomoff, Nick, Miyazawa, Risa, Kohara, Sayuri, Farooq, Mukta, Hisada, Takashi, Oakley, Jennifer, Skordas, Spyridon, Fan, Susan, Sakuma, Katsuyuki, Knickerbocker, John, Mcherron, Dale, Tamura, Takeshi, Ishii, Takayuki, Jaipan, Panupong, Nishimura, Satoshi, Son, Ilseok, Maeda, Yohei, Koga, Takashi, Klein, Joseph, Tashiro, Kei, Arkalgud, Sitaram, Kondo, Yoshihiro
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
CT-Guided Fiducial Marker Implantation with Ultra-fine 25-Gauge Needle Prior to Proton Therapy for Liver Malignancies
Horibe, Akihiro, Ohta, Kengo, Shoji, Jumpei, Hatano, Mototaka, Shiotani, Yujiro, Anan, Kumiko, Nomura, Kento, Iwata, Hiromitsu, Ogino, Hiroyuki
Published in Cardiovascular and interventional radiology (01.09.2024)
Published in Cardiovascular and interventional radiology (01.09.2024)
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Journal Article
Implementation challenges for scalable neuromorphic computing
Yamamichi, Shintaro, Horibe, Akihiro, Aoki, Toyohiro, Hosokawa, Kohji, Hisada, Takashi, Mori, Hiroyuki
Published in 2017 Symposium on VLSI Technology (01.06.2017)
Published in 2017 Symposium on VLSI Technology (01.06.2017)
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Conference Proceeding
SEMICONDUCTOR STRUCTURE INCLUDING THROUGH ELECTRODE, AND METHOD FOR FORMING THE SAME
SUEOKA KUNIAKI, HORIBE AKIHIRO, TORIYAMA KAZUSHIGE, ORII YASUMITSU, MORI HIROYUKI
Year of Publication 04.04.2016
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Year of Publication 04.04.2016
Patent
METHOD OF FORMING SOLDER JOINT BETWEEN METAL LAYERS
HORIBE AKIHIRO, AOKI TOYOHIRO, YANG TING LI, TORIYAMA KAZUSHIGE, ORII YASUMITSU, MORI HIROYUKI
Year of Publication 11.04.2016
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Year of Publication 11.04.2016
Patent
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
Miyazawa, Risa, Marushima, Chinami, Aoki, Toyohiro, Horibe, Akihiro, Hisada, Takashi
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding