Search Results - "HONG YE JIE" :: K.UTB vyhledávací portál

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KPCA Based Novelty Detection Method Using Maximum Correntropy Criterion

by Li, Qi-ye, Xing, Hong-jie
Published in Ji suan ji ke xue (01.08.2022)

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Isoflavones and Prostate Cancer： A Review of Some Critical Issues

by Zhang, Hong-Yi, Cui, Jie, Zhang, Ye, Wang, Zhen-Long, Chong, Tie, Wang, Zi-Ming
Published in Chinese medical journal (05.02.2016)

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Journal Article

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Perioperative restricted fluid therapy preserves immunological function in patients with colorectal cancer

by Jie, Hong-Ying, Ye, Ji-Lu, Zhou, Hai-Hua, Li, Yun-Xiang
Published in World journal of gastroenterology : WJG (14.11.2014)

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Tracking in vivo migration and distribution of antigen-specific cytotoxic T lymphocytes by 5,6-carboxyfluorescein diacetate succinimidyl ester staining during cancer immunotherapy

by Xu, Wei-li, Li, Suo-lin, Wen, Ming, Wen, Jun-ye, Han, Jie, Zhang, Hong-zhen, Gao, Fei, Cai, Jian-hui
Published in Chinese medical journal (01.08.2013)

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Journal Article

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FDTD analysis of the optical properties of vertical ZnO nanorod array

by Shu, Yue, Ye, Hong, Chen, Jie
Published in Science China. Technological sciences (01.06.2014)

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Journal Article

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Effect of Final Kissing Balloon Dilatation after One-stent Technique at Left-main Bifurcation： A Single Center Data

by Gao, Zhan, Xu, Bo, Yang, Yue-Jin, Qiao, Shu-Bin, Wu, Yong-Jian, Chen, Tao, Xu, Liang, Yuan, Jin-Qing, Chen, Jue, Qin, Xue-Wen, Yao, Min, Liu, Hai-Bo, You, Shi-Jie, Zhao, Ye-Lin, Yan, Hong-Bing, Chen, Ji-Lin, Gao, Run-Lin
Published in Chinese medical journal (20.03.2015)

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Journal Article

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Chip high-density interconnection packaging structure and manufacturing method thereof

by HUANG, BEN-XIA, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 16.03.2024

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Patent

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Manufacturing method of device embedded packaging structure

by HUANG, BEN-XIA, FENG, LEI, FENG, JIN-DONG, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 01.03.2024

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Patent

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Packaging structure for realizing chip interconnection and manufacturing method thereof

by HUANG, BEN-XIA, DENG, XIAO-FENG, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 01.02.2024

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TWI823387B

by FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 21.11.2023

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Patent

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TWI819851B

by FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 21.10.2023

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Patent

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Packaging substrate based on molding process and manufacturing method thereof

by FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 16.07.2023

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Patent

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B7-H4 expression is elevated in human U251 glioma stem-like cells and is inducible in monocytes cultured with U251 stem-like cell conditioned medium

by Mo, Lian-Jie, Ye, Hong-Xing, Mao, Ying, Yao, Yu, Zhang, Jian-Min
Published in Ai zheng (01.12.2013)

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Journal Article

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Substrate manufacturing method, embedded substrate and semiconductor

by HUANG, BEN-XIA, HUANG, JUN, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING, LIN, WEN-JIAN
Year of Publication 16.05.2024

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Patent

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Structure for embedding and packaging multiple devices by layer and method for manufacturing same

by FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 16.06.2023

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Patent

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Double-sided interconnected embedded chip packaging structure and manufacturing method thereof

by HUANG, BEN-XIA, FENG, JIN-DONG, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 01.06.2023

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Hybrid embedded packaging structure and manufacturing method thereof

by FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 01.06.2023

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Patent

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Plastic package cavity structure and manufacturing method thereof

by FENG, LEI, HUANG, BEN-XIA, ZHAO, JIANG-JIANG, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 16.04.2024

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TMV packaging structure with signal heat separation function and manufacturing method thereof

by FENG, LEI, HUANG, BEN-XIA, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 01.05.2023

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Embedded packaging structure and manufacturing method thereof

by HUANG, BEN-XIA, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 01.05.2023

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Patent

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