Multiphysics modeling and design of ultralarge multiwafer MOVPE reactor for group III-nitride light emitting diodes
Changsung Sean Kim, Jongpa Hong, Jihye Shim, Yongsun Won, Yong-Il Kwon
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
High Performance 3D Package Technology for Mobile Application Processor (AP)
Kim, Sun Jae, Kim, Cheol, Jang, Huiyeong, Hong, Jongpa, Kim, Seongyo, Choi, Yongwon, Jo, Chajea, Seo, Sun-Kyung, Kim, Dong Kwan, Kim, Dae-Woo
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Process optimization of micro bump pitch design in 3-dimensional package structure
Kim, Sun Jae, Kim, Hyoeun, Hong, Jongpa, Kwon, Ohguk, Lee, Hyoungjoo
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Predicting reliability behavior in HBM packages through numerical simulation
O, Sangkun, Hong, Jongpa, Lee, Sangmin, Kyung, Seoeun, Lee, Junho, Kim, Kilsoo, Park, Jihyun, Oh, Dan
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
SEMICONDUCTOR PACKAGE
CHANG, Gunho, KO, Yeongkwon, HONG, Jongpa, KIM, Wonyoung, KIM, Wonkeun
Year of Publication 05.09.2024
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Year of Publication 05.09.2024
Patent
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
LEE, HYUEKJAE, HONG, JONGPA, HONG, JISEOK, HWANG, JIHWAN, KIM, TAEHUN
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
Semiconductor packages having improved reliability in bonds between connection conductors and pads
Hong, Jiseok, Lee, Hyuekjae, Hwang, Jihwan, Kim, Taehun, Hong, Jongpa
Year of Publication 26.10.2021
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Year of Publication 26.10.2021
Patent
Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration
Kim, Min Jung, Lee, Seok Hyun, Suk, Kyoung Lim, Jang, Jae Gwon, Jeon, Gwang-Jae, Choi, Ju-il, Yun, Hyo Jin, Hong, Jongpa, Choi, Ju-Yeon, Lee, Won Jae, Jung, SukHyun, Choi, Won Kyoung, Kim, Dae-Woo
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
LEE, HYUEKJAE, HONG, JONGPA, HONG, JISEOK, HWANG, JIHWAN, KIM, TAEHUN
Year of Publication 13.05.2021
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Year of Publication 13.05.2021
Patent