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"HONG JINGWEI"
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"HONG JINGWEI"
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Movable pre-tensioning U-shaped pre-stressed concrete sheet pile die
by
HE WEI
,
LI DECHENG
,
HONG JINGWEI
Year of Publication
25.12.2013
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Movable type pre-tensioning method U-shaped pre-stressed concrete sheet pile die tensioning device
by
HE WEI
,
LI DECHENG
,
HONG JINGWEI
Year of Publication
25.12.2013
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Semiconductor encapsulating structure with radiation fins
by
HONG JINGWEI
,
YU BINGXUN
Year of Publication
13.04.2011
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Cooling type multi-punch semiconductor packaging construction
by
HONG JINGWEI
,
YU BINGXUN
Year of Publication
27.10.2010
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Semiconductor encapsulating structure with radiation fins
by
HONG JINGWEI
,
YU BINGXUN
Year of Publication
14.10.2009
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Cooling type multi-punch semiconductor packaging construction
by
HONG JINGWEI
,
YU BINGXUN
Year of Publication
05.08.2009
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Open type ball grid array substrate and packaging structure thereof
by
YU CAIJUAN
,
FAN WENZHENG
,
HONG JINGWEI
Year of Publication
21.09.2011
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Semiconductor encapsulation structure having substrate identification code and manufacturing method thereof
by
WANG JINFA
,
HONG JINGWEI
,
CHEN JINDI
,
YU BINGXUN
Year of Publication
16.03.2011
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Open type ball grid array substrate and packaging structure thereof
by
YU CAIJUAN
,
FAN WENZHENG
,
HONG JINGWEI
Year of Publication
16.06.2010
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Substrate panel
by
YU CAIJUAN
,
FAN WENZHENG
,
HONG JINGWEI
Year of Publication
09.06.2010
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Semiconductor encapsulation structure having substrate identification code and manufacturing method thereof
by
WANG JINFA
,
HONG JINGWEI
,
CHEN JINDI
,
YU BINGXUN
Year of Publication
22.07.2009
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Substrate panel
by
YU CAIJUAN
,
FAN WENZHENG
,
HONG JINGWEI
Year of Publication
01.07.2009
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