Investigation to Enhance Solid Fuel Quality in Torrefaction of Cow Manure
Hong, Jiseok, Chae, Changwon, Kim, Hyunjoong, Kwon, Hyeokjun, Kim, Jisu, Kim, Ijung
Published in Energies (Basel) (01.06.2023)
Published in Energies (Basel) (01.06.2023)
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Journal Article
Removal of amoxicillin by coffee grounds biochar with different pretreatment methods
Choi, Sue Won, Hong, Jiseok, Youn, Sungmin, Kim, Ijung
Published in Environmental advances (01.12.2023)
Published in Environmental advances (01.12.2023)
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Journal Article
Continuous VOCs Monitoring in Saturated and Unsaturated Zones Using Thermal Desorber and Gas Chromatography: System Development and Field Application
An, Jinsung, Baek, Dong-Jun, Hong, Jiseok, Choi, Eunsoo, Kim, Ijung
Published in International journal of environmental research and public health (14.03.2022)
Published in International journal of environmental research and public health (14.03.2022)
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Journal Article
Performance evaluation of particulate matter removal by surfactant foams
Chae, Changwon, Hong, Jiseok, Kim, Hyunjoong, Park, Younghyun, Lee, Hahyeon, So, Byunghyeon, Choi, Sue Won, Kim, Ijung
Published in Atmospheric pollution research (01.01.2024)
Published in Atmospheric pollution research (01.01.2024)
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Journal Article
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
LEE KISEOK, HAN JUNG HOON, HONG JISEOK, YOON CHAN SIC, PARK JEMIN, MOON ILYOUNG
Year of Publication 01.12.2023
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Year of Publication 01.12.2023
Patent
Semiconductor memory device
HAN SEUNGUK, LEE KISEOK, AHN JIYOUNG, HONG JISEOK, CHOI YOONYOUNG, PARK SEORYONG
Year of Publication 26.01.2022
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Year of Publication 26.01.2022
Patent
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
LEE KISEOK, HAN JUNG HOON, HONG JISEOK, YOON CHAN SIC, PARK JEMIN, MOON ILYOUNG
Year of Publication 30.04.2019
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Year of Publication 30.04.2019
Patent
Integrated circuit device having a bit line and a main insulating spacer with an extended portion
Kim, Sunghwan, Hong, Jiseok, Lee, Kiseok, Choi, Yoonyoung, Ahn, Jiyoung, Han, Seunguk, Park, Seoryong, Han, Taehee
Year of Publication 20.02.2024
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Year of Publication 20.02.2024
Patent
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
LEE, HYUEKJAE, HONG, JONGPA, HONG, JISEOK, HWANG, JIHWAN, KIM, TAEHUN
Year of Publication 03.03.2022
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Year of Publication 03.03.2022
Patent
Semiconductor package including underfill material layer and method of forming the same
Hong, Jiseok, Hwang, Jihwan, Lee, Hyuekjae, Kim, Taehun, Suh, Jihwan, Lee, Soyoun
Year of Publication 19.09.2023
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Year of Publication 19.09.2023
Patent
Semiconductor package having stacked semiconductor chips
Hong, Jiseok, Lee, Hyuekjae, Hwang, Jihwan, Kim, Taehun, Suh, Jihwan, Lee, Soyoun, Kim, Jihoon
Year of Publication 08.08.2023
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Year of Publication 08.08.2023
Patent
Semiconductor packages having improved reliability in bonds between connection conductors and pads
Hong, Jiseok, Lee, Hyuekjae, Hwang, Jihwan, Kim, Taehun, Hong, Jongpa
Year of Publication 26.10.2021
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Year of Publication 26.10.2021
Patent
INTEGRATED CIRCUIT DEVICE
Lee, Sangho, HONG, Jiseok, Lee, Kiseok, Choi, Yoonyoung, Ahn, Jiyoung, Park, Seoryong, Han, Seunguk
Year of Publication 20.07.2023
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Year of Publication 20.07.2023
Patent
Die-to-wafer bonding structure and semiconductor package using the same
Kang, Unbyoung, Hong, Jiseok, Park, Sangcheon, Kang, Myungsung, Lee, Hyuekjae, Hwang, Jihwan, Kim, Taehun
Year of Publication 23.05.2023
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Year of Publication 23.05.2023
Patent
Integrated circuit device
Hong, Jiseok, Lee, Sangho, Lee, Kiseok, Choi, Yoonyoung, Ahn, Jiyoung, Park, Seoryong, Han, Seunguk
Year of Publication 09.05.2023
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Year of Publication 09.05.2023
Patent