Package with electrically insulated carrier and at least one step on encapsulant
Hong, Chii Shang, Schmoelzer, Bernd, Fuergut, Edward, Tean, Ke Yan, Lee, Teck Sim, Wang, Lee Shuang
Year of Publication 17.09.2024
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Year of Publication 17.09.2024
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Semiconductor package with releasable isolation layer protection
Daryl Yeow, Yee Beng, Hong, Chii Shang, Kassim, Azlina, Chong, Li Fong, Lit, Hui Kin
Year of Publication 03.09.2024
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Year of Publication 03.09.2024
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SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
Hong, Chii Shang, Lam, Chee Ming, Enverge, Angel, Narayanasamy, Jayaganasan, Murugan, Sanjay Kumar, Senivasan, Subaramaniym
Year of Publication 02.05.2024
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Year of Publication 02.05.2024
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Linear spacer for spacing a carrier of a package
Hong, Chii Shang, Schmoelzer, Bernd, Fuergut, Edward, Lee, Teck Sim, Otremba, Ralf, Pedone, Daniel
Year of Publication 26.03.2024
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Year of Publication 26.03.2024
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Power semiconductor device with dual heat dissipation structures
Hong, Chii Shang, Lam, Chee Ming, Narayanasamy, Jayaganasan, Enverga, Angel, Murugan, Sanjay Kumar, Senivasan, Subaramaniym
Year of Publication 20.02.2024
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Year of Publication 20.02.2024
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PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT
WANG, Lee Shuang, LEE, Teck Sim, FUERGUT, Edward, SCHMOELZER, Bernd, TEAN, Ke Yan, HONG, Chii Shang
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
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Package with electrically insulated carrier and at least one step on encapsulant
Hong, Chii Shang, Schmoelzer, Bernd, Fuergut, Edward, Tean, Ke Yan, Lee, Teck Sim, Wang, Lee Shuang
Year of Publication 16.01.2024
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Year of Publication 16.01.2024
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Semiconductor package with releasable isolation layer protection
Daryl Yeow, Yee Beng, Hong, Chii Shang, Kassim, Azlina, Chong, Li Fong, Lit, Hui Kin
Year of Publication 17.10.2023
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Year of Publication 17.10.2023
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SEMICONDUCTOR PACKAGE WITH RELEASABLE ISOLATION LAYER PROTECTION
LIT, Hui Kin, CHONG, Li Fong, HONG, Chii Shang, KASSIM, Azlina, DARYL YEOW, Yee Beng
Year of Publication 11.01.2023
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Year of Publication 11.01.2023
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Semiconductor Package with Releasable Isolation Layer Protection
Daryl Yeow, Yee Beng, Hong, Chii Shang, Kassim, Azlina, Chong, Li Fong, Lit, Hui Kin
Year of Publication 29.12.2022
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Year of Publication 29.12.2022
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SEMICONDUCTOR PACKAGE WITH RELEASABLE ISOLATION LAYER PROTECTION
LIT, Hui Kin, CHONG, Li Fong, HONG, Chii Shang, KASSIM, Azlina, DARYL YEOW, Yee Beng
Year of Publication 28.12.2022
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Year of Publication 28.12.2022
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SEMICONDUCTOR PACKAGE HAVING AN EMBEDDED ELECTRICAL CONDUCTOR CONNECTED BETWEEN PINS OF A SEMICONDUCTOR DIE AND A FURTHER DEVICE
WANG, Lee Shuang, LEE, Teck Sim, SCHMOELZER, Bernd, ALOMAR DOMINGUEZ, Marta, BÖHM, Marcus, FÜRGUT, Edward, HONG, Chii Shang
Year of Publication 09.11.2023
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Year of Publication 09.11.2023
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PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT
WANG, Lee Shuang, LEE, Teck Sim, FUERGUT, Edward, SCHMOELZER, Bernd, TEAN, Ke Yan, HONG, Chii Shang
Year of Publication 19.05.2022
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Year of Publication 19.05.2022
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LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
Hong, Chii Shang, Schmoelzer, Bernd, Fuergut, Edward, Lee, Teck Sim, Otremba, Ralf, Pedone, Daniel
Year of Publication 12.05.2022
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Year of Publication 12.05.2022
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Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip
Hong, Chii Shang, Tean, Ke Yan, Joanna Chye, Jo Ean, Lit, Hui Kin, Wang, Wei-Shan, Otremba, Ralf, Lee, Teck Sim, Wang, Lee Shuang
Year of Publication 31.10.2023
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Year of Publication 31.10.2023
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