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Year of Publication 09.05.2023
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Force sensing with an electromagnetic load
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Year of Publication 08.03.2023
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METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN INTEGRATED CIRCUIT PACKAGES
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Year of Publication 06.07.2022
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Force sensing with an electromagnetic load
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Year of Publication 24.11.2021
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METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN INTEGRATED CIRCUIT PACKAGES
HOLLAND, Kathryn Rose, PANG, Yaoyu, TARABBIA, Marc L, BARR, Alexander
Year of Publication 04.03.2021
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Year of Publication 04.03.2021
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METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN INTEGRATED CIRCUIT PACKAGES
HOLLAND, Kathryn Rose, PANG, Yaoyu, TARABBIA, Marc L, BARR, Alexander
Year of Publication 04.03.2021
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Year of Publication 04.03.2021
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FORCE SENSING WITH AN ELECTROMAGNETIC LOAD
STÅHL, Carl Lennart, HOLLAND, Kathryn Rose, MARCHAIS, Emmanuel, LINDEMANN, Eric
Year of Publication 08.10.2020
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Year of Publication 08.10.2020
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FORCE SENSING WITH AN ELECTROMAGNETIC LOAD
STÅHL, Carl Lennart, HOLLAND, Kathryn Rose, MARCHAIS, Emmanuel, LINDEMANN, Eric
Year of Publication 01.10.2020
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Year of Publication 01.10.2020
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Metal layer patterning for minimizing mechanical stress in integrated circuit packages
HOLLAND, KATHRYN ROSE, TARABBIA, MARC L, BARR, ALEXANDER, PANG, YAOYU
Year of Publication 01.10.2023
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Year of Publication 01.10.2023
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Metal layer patterning for minimizing mechanical stress in integrated circuit packages
HOLLAND, KATHRYN ROSE, PANG, YAO-YU, TARABBIA, MARC L, BARR, ALEXANDER
Year of Publication 16.06.2021
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Year of Publication 16.06.2021
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