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Year of Publication 25.06.2021
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Year of Publication 25.06.2021
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 16.06.2020
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Year of Publication 16.06.2020
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 23.09.2019
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Year of Publication 23.09.2019
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 15.01.2019
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Year of Publication 15.01.2019
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HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER
SINGH SARAVJEET, HOLDEN JAMES M, YALAMANCHILI MADHAVA RAO, EATON BRAD, KUMAR AJAY, LEI WEI SHENG, EGAN TODD J
Year of Publication 13.12.2018
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Year of Publication 13.12.2018
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PROXIMITY CONTACT COVER RING FOR PLASMA DICING
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Year of Publication 23.05.2017
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Year of Publication 23.05.2017
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 14.01.2015
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Year of Publication 14.01.2015
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MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 06.01.2015
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Year of Publication 06.01.2015
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 03.07.2014
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Year of Publication 03.07.2014
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MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER AND PLASMA ETCH
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Year of Publication 02.06.2014
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Year of Publication 02.06.2014
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MULTI-LAYER MASK FOR SUBSTRATE DICING BY LASER BY LASER AND PLASMA ETCH
HOLDEN JAMES M, SINGH SARAVJEET, EATON BRAD, LEI WEI SHENG, EGAN TODD
Year of Publication 04.04.2014
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Year of Publication 04.04.2014
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MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 27.03.2014
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Year of Publication 27.03.2014
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
YALAMANCHILI MADHAVA RAO, SINGH SARAVJEET, HOLDEN JAMES M, EATON BRAD, KUMAR AJAY, LEI WEI SHENG
Year of Publication 22.07.2013
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Year of Publication 22.07.2013
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HYBRID LASER AND PLASMA ETCH WAFER DICING USING SUBSTRATE CARRIER
SINGH SARAVJEET, HOLDEN JAMES M, YALAMANCHILI MADHAVA RAO, EATON BRAD, KUMAR AJAY, LEI WEI SHENG, EGAN TODD J
Year of Publication 31.03.2014
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Year of Publication 31.03.2014
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WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
Yalamanchili, Madhava Rao, Singh, Saravjeet, Lei, Wei-Sheng, Kumar, Ajay, Eaton, Brad, Holden, James M
Year of Publication 29.06.2023
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Year of Publication 29.06.2023
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Wafer dicing using femtosecond-based laser and plasma etch
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Year of Publication 04.04.2023
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Year of Publication 04.04.2023
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Proximity contact cover ring for plasma dicing
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Year of Publication 07.12.2021
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Year of Publication 07.12.2021
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