Search Results - "HOEBEL ALBERT-ANDREAS" :: K.UTB vyhledávací portál

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Verfahren zur Herstellung einer elektronischen Schaltung

by Jacob, Wolfgang, Becker, Rolf, Ruf, Christoph, Hoebel, Albert-Andreas
Year of Publication 09.01.2020

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PROCEDE DE FABRICATION D'UNE LIAISON DE FIL D'OR RESISTANT A UNE TEMPERATURE ELEVEE POUR UN COMPOSANT ELECTRONIQUE

by HOEBEL ALBERT ANDREAS, HENNEKEN LOTHAR, NEUDERT RALPH, MUELLER IMMANUEL
Year of Publication 29.07.2011

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Method for producing an electronic circuit

by Jacob, Wolfgang, Ruf, Christoph, Hoebel, Albert-Andreas, Becker, Rolf
Year of Publication 13.10.2009

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Method for producing an electronic circuit

by HOEBEL ALBERT-ANDREAS, BECKER ROLF, JACOB WOLFGANG, RUF CHRISTOPH
Year of Publication 13.10.2009

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Verfahren zur Herstellung einer leitenden Beschichtung auf einem isolierenden Substrat

by Beck, Walter, Bachor, Bernhard, Schaible, Dietmar, Ochs, Eric, Schwaiger, Juergen, Roethlingshoefer, Walter, Hoebel, Albert-Andreas, Dambock, Klaus-Peter, Nitsche, Detlef
Year of Publication 30.05.2018

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Method for Producing an Electronic Circuit

by HOEBEL ALBERT-ANDREAS, BECKER ROLF, JACOB WOLFGANG, RUF CHRISTOPH
Year of Publication 04.10.2007

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Method for producing a conductive coating on an insulating substrate

by Beck, Walter, Ochs, Eric, Roethlingshoefer, Walter, Bachor, Bernhard, Schaible, Dietmar, Hoebel, Albert-Andreas, Dambock, Klaus-Peter, Schwaiger, Juergen, Nitsche, Detlef
Year of Publication 12.07.2011

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Method for producing a conductive coating on an insulating substrate

by OCHS ERIC, BACHOR BERNHARD, HOEBEL ALBERT-ANDREAS, NITSCHE DETLEF, ROETHLINGSHOEFER WALTER, SCHAIBLE DIETMAR, SCHWAIGER JUERGEN, BECK WALTER, DAMBOCK KLAUS-PETER
Year of Publication 12.07.2011

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CARRIER PLATE FOR MICRO-HYBRID CIRCUITS

by GOEBEL, ULRICH, HUBER, ELMAR, HOEBEL, ALBERT-ANDREAS
Year of Publication 07.08.2003

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CARRIER PLATE FOR MICRO-HYBRID CIRCUITS

by HUBER ELMAR, GOEBEL ULRICH, HOEBEL ALBERT-ANDREAS
Year of Publication 07.08.2003

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Gold wire connection manufacturing method for semiconductor component, involves applying gold layer on diffusion blocking layers arranged on catalyst layer, and connecting gold wire to gold layer by welding process

by HOEBEL ALBERT ANDREAS, HENNEKEN LOTHAR, NEUDERT RALPH, MUELLER IMMANUEL
Year of Publication 25.03.2005

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PROCEDIMENTO PER LA FABBRICAZIONE DI UN COLLEGAMENTO A FILO D'ORO RESISTENTE ALLE ALTE TEMPERATURE

by HOEBEL ALBERT-ANDREAS, HENNEKEN LOTHAR, NEUDERT RALPH, MUELLER IMMANUEL
Year of Publication 15.12.2004

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Heat sink with metallic body, used for cooling electronic components, has recess on one side containing ceramic impregnated with metal

by HOEBEL, ALBERT-ANDREAS, TRESCHER, ULRICH, JACOB, WOLFGANG, RUF, CHRISTOPH
Year of Publication 15.04.2004

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ELECTRICAL CIRCUIT AND SUBSTRATE THEREFOR

by HOEBEL, ALBERT-ANDREAS, RAICA, THOMAS, HAUGENEDER, ANDREAS, HEIDER, FRANK, RAUTZENBERG, BERND
Year of Publication 12.07.2006

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PROCEDE POUR FABRIQUER UN REVETEMENT CONDUCTEUR SUR UN SUBSTRAT ISOLANT ET SUBSTRAT OBTENU

by HOEBEL ALBERT ANDREAS, OCHS ERIC, BACHOR BERNHARD, NITSCHE DETLEF, ROETHLINGSHOEFER WALTER, DAMBOCK KLAUS PETER, SCHAIBLE DIETMAR, SCHWAIGER JUERGEN, BECK WALTER
Year of Publication 09.02.2007

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Method for connecting electronic components to a substrate, and a method for checking such a connection

by Benzler, Jan, Hoebel, Albert-Andreas, Schmidt, Gerhard, Rupprecht, Stefan, Ruzicka, Thomas, Schuetz, Reiner, Hongquan, Jiang
Year of Publication 20.01.2004

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Method for connecting electronic components to a substrate, and a method for checking such a connection

by HOEBEL ALBERT-ANDREAS, RUPPRECHT STEFAN, RUZICKA THOMAS, BENZLER JAN, SCHMIDT GERHARD, SCHUETZ REINER, HONGQUAN JIANG
Year of Publication 20.01.2004

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