77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing
Sun, Mei, Guan Lim, Teck, Soon Wee Ho, David, Wu, Jiaqi, Chai, Tai Chong, Ma, Yugang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2024)
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Journal Article
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Li, Rui, Jin, Cheng, Ong, Siong Chiew, Lim, Teck Guan, Chang, Ka Fai, Ho, Soon Wee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
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Journal Article
3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections
Khan, N., Li Hong Yu, Tan Siow Pin, Soon Wee Ho, Kripesh, V., Pinjala, D., Lau, J. H., Toh Kok Chuan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2013)
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Journal Article
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
Aibin Yu, Lau, J. H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong, Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
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Journal Article
Low Loss Suspended Membrane on Low Resistivity Silicon and Its Applications to Millimetre-Wave Passive Circuits
Li, Rui, Jin, Cheng, Tang, Min, Chang, Ka Fai, Ho, Soon Wee, Chen, Zhaohui, Zheng, Boyu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2014)
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Journal Article
Through Mold Vertical Interconnect Formation in FOWLP using conductive paste
Siew Boon, Serine Soh, David Ho, Soon Wee, Jaafar, Norhanani
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of Large RDL Interposer Package using RDL-first FOWLP Process
Ho, Soon Wee, Boon Soh, Siew, Lau, Boon Long, Hsiang-Yao, Hsiao, Rao, Vempati Srinivasa
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages
Ong, Xuefen, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong
Published in Microelectronics and reliability (01.02.2009)
Published in Microelectronics and reliability (01.02.2009)
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Journal Article
Development of 25-μm-Pitch Microbumps for 3-D Chip Stacking
AIBIN YU, KUMAR, Aditya, CHAN, Chien-Feng, CHAO, Chun-Chieh, CHIU, Chi-Hsin, CHAN, Chang-Yueh, CHANG, Chin-Huang, HUANG, Chih-Ming, CARL CHEN, SOON WEE HO, HNIN WAI YIN, LAU, John H, SU, Nandar, KHONG CHEE HOUE, JONG MING CHING, KRIPESH, Vaidyanathan, CHEN, Scott
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2012)
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Journal Article
Design, assembly and reliability of large die and fine-pitch Cu/low- k flip chip package
Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun
Published in Microelectronics and reliability (01.07.2010)
Published in Microelectronics and reliability (01.07.2010)
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Journal Article
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
Rao, V. S., Sekhar, V. N., Ho Soon Wee, Rajoo, R., Sharma, G., Lim Ying Ying, Damaruganath, P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
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Journal Article
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Won Kyoung Choi, Soon Wee Ho, Siong Chiew Ong, Ling Xie, Pinjala, D, Dim-Lee Kwong, Yee Mong Khoo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
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Journal Article
Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package
Yue Ying Ong, Soon Wee Ho, Sekhar, V N, Xuefen Ong, Ong, J, Xiaowu Zhang, Vaidyanathan, K, Seung Uk Yoon, Lau, J H, Lim Yeow Kheng, Yeo, D, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
3D FOWLP Integration
Guan, Lim Teck, Soon Wee Ho, David, Chong, Chai Tai, Bhattacharya, Surya
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages
Pahwa, Ramanpreet S, Soon Wee Ho, Ren, Qin, Chang, Richard, Oo, Zaw Min, Wang, Jie, Vempati Srinivasa Rao, Tin Lay Nwe, Yang, Yanjing, Jens Timo Neumann, Ramani Pichumani, Gregorich, Thomas
Published in arXiv.org (20.05.2021)
Published in arXiv.org (20.05.2021)
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Paper
Journal Article