A novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology
Lim Ying Ying, David, H. S. W., Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Molding process development for high density I/Os Fan-Out Wafer Level Package (FOWLP) with fine pitch RDL
Mian Zhi Ding, Ser Choong Chong, Ho, David Soon Wee, Lim, Sharon Pei Siang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Development of negative profile of dry film resist for metal lift off process
Chew, Michelle, Ho, Soon Wee, Su, Nandar, Liao, Ebin, Rao, Vempati Srinivas, Premachandran, C.S., Kumar, Rakesh, Damaruganath, Pinjala
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Evaluation of support wafer system for thin wafer handling
Justin, W H S T, Tai Chong Chai, Rao, V S, David, S W H, Fernandez, D M, Li Yan Siow, Wen Sheng Lee, Serene, M L T, Lee, J
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level
Hoe, Yen Yi Germaine, Gongyue, Tang, Sharma, Gaurav, Pinjala, Damaragunath, Rao, Vempati Srinivasa, Chinq, Jong Ming, Siang, Sharon Lim Pei, Kumar, Aditya, Wee, Ho Soon, Xiaowu, Zhang, Kripesh, V.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Drop impact reliability study of high density fan-out wafer level package
Zhaohui Chen, Faxing Che, Mian Zhi Ding, Ho, David Soon Wee, Tai Chong Chai, Rao, Vempati Srinivasa
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections
Khan, N., Hong Yu, Tan Siow Pin, Soon Wee Ho, Nandar Su, Wai Yin Hnin, Kripesh, V., Pinjala, Lau, J.H., Toh Kok Chuan
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Study of 15µm pitch solder microbumps for 3D IC integration
Aibin Yu, Lau, J.H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Da-Quan Yu, Ming Ching Jong, Kripesh, V., Pinjala, D., Dim-Lee Kwong
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
A Systematic Underfill Selection Methodology for Fine Pitch Cu/Low-k FCBGA Package
Ong, Xuefen, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Simulation and testing for drop impact reliability of 3D eWLP
Zhaohui Chen, Boo Yang Jung, Sharon Pei Siang Lim, Ho, David Soon Wee, Xiaowu Zhang
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Development of low profile fan out PoP solution with embedded passive
Jung, Boo Yang, Ho, David Soon Wee, Sorono, Dexter Velez, Lim, Sharon Pei Siang, Chen, Zhaohui, Yong, Han, Lin, Bu, Chong, Chai Tai
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)
Chen, Zhaohui, Jung, Boo Yang, Lim, Sharon Pei Siang, Velez, Dexter Sorono, Ho, David Soon Wee, Zhang, Xiaowu
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Low standoff Chip to Wafer bonding
Ser Choong Chong, Wee, David Ho Soon, Keng Hwa Teo
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package
Ong, Y.Y., Vaidyanathan, K., Ho, S.W., Sekhar, V.N., Jong, M.C., Wai, L.C., Rao, V.S., Sheng, V., Ong, J., Ong, X., Zhang, X., Seung, Y.U., Lau, J., Lim, Y.K., Yeo, D., Chan, K.C., Yanfeng, Z., Tan, J.B., Sohn, D.K.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
135GHz antenna array on BCB membrane backed by polymer-filled cavity
Siew Bee Yeap, Zhi Ning Chen, Xianming Qing, Li Rui, Ho, D. S. W., Lim Teck Guan
Published in 2012 6th European Conference on Antennas and Propagation (EUCAP) (01.03.2012)
Published in 2012 6th European Conference on Antennas and Propagation (EUCAP) (01.03.2012)
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Conference Proceeding
Through Silicon Via interposer for millimetre wave applications
Teck Guan Lim, Yee Mong Khoo, Selvanayagam, C. S., Ho, D. S. W., Rui Li, Xiaowu Zhang, Gao Shan, Xiong Yong Zhong
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP)
Lim Ying Ying, Wee, D. H. S., Kim Hyoung Joon, Damaruganath, P.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Three chips stacking with low volume solder using single re-flow process
Khan, Navas, Wee, David Ho Soon, Ong Siong Chiew, Sharmani, Cheryl, Li Shiah Lim, Hong Yu Li, Vasarala, Shekar
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Process challenges and development of eWLP
Ser Choong Chong, Chee Houe Khong, Sing, Keith Lim Cheng, Wee, David Ho Soon, Liang, Calvin Teo Wei, Sheng, Vincent Lee Wen, Kim Hyoung Joon, Jaesik Lee, Rao, Vempati Srinivasa
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Process and reliability assessment of 200μm-thin embedded wafer level packages (EMWLPs)
Hyoung Joon Kim, Ser Choong Chong, Ho, D. S. W., Yong, E. W. Y., Chee Houe Khong, Teo, C. W. L., Fernandez, D. M., Guan Kian Lau, Vasarla, N. S., Lee, V. W. S., Vempati, S. R., Navas, K. O. K.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding