Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics
Chidambaram, Vivek, Yeung, Ho Beng, Shan, Gao
Published in Journal of electronic materials (01.08.2012)
Published in Journal of electronic materials (01.08.2012)
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Journal Article
Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications
Chidambaram, Vivek, Yeung, Ho Beng, Shan, Gao
Published in Journal of electronic materials (01.08.2012)
Published in Journal of electronic materials (01.08.2012)
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Journal Article
High-temperature endurable encapsulation material
Chidambaram, V., Ho Beng Yeung, Chan Yuen Sing, Woo, D. R. M.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Ceramic - Ceramic joining using glass frit for high temperature application
Lim Jun Zhang, Sharif, A., Ho Beng Yeung, Rong, E. P. J., Riko, I. M., Lau Fu Long, Lim Ju Dy, Wong Chee Cheong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
High reliability gold based solder alloys for micro-electronics packaging for high temperature applications
Chidambaram, V., Ho Beng Yeung, Gao Shan
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
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Conference Proceeding
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
Nathapong SUTHIWONGSUNTHORN, Poh Leng Wilson ONG, William John NELSON, Beng Yeung HO
Year of Publication 30.05.2019
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Year of Publication 30.05.2019
Patent
Methods for singulating semiconductor wafer
Nelson William John, Ho Beng Yeung, Suthiwongsunthorn Nathapong, Ong Poh Leng Wilson
Year of Publication 22.08.2017
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Year of Publication 22.08.2017
Patent
Semiconductor packages and methods of packaging semiconductor devices
Micla, Wedanni Linsangan, Suthiwongsunthorn, Nathapong, De Vera, Nelson Agbisit, Huang, Rui, Robles, Roel Adeva, Dimaano, Antonio Jr. Bambalan, Ho, Beng Yeung, Tan, Hua Hong, Le, Kriangsak Sae
Year of Publication 16.07.2019
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Year of Publication 16.07.2019
Patent
Methods for singulating semiconductor wafer
Nelson William John, Ho Beng Yeung, Suthiwongsunthorn Nathapong, Ong Poh Leng Wilson
Year of Publication 14.02.2017
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Year of Publication 14.02.2017
Patent
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
NATHAPONG SUTHIWONGSUNTHORN, WILLIAM JOHN NELSON, POH LENG WILSON ONG, BENG YEUNG HO
Year of Publication 30.05.2016
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Year of Publication 30.05.2016
Patent
Semiconductor packages and methods of packaging semiconductor devices
Micla, Wedanni Linsangan, Suthiwongsunthorn, Nathapong, De Vera, Nelson Agbisit, Huang, Rui, Robles, Roel Adeva, Dimaano, Antonio Jr. Bambalan, Ho, Beng Yeung, Tan, Hua Hong, Le, Kriangsak Sae
Year of Publication 22.05.2018
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Year of Publication 22.05.2018
Patent
Semiconductor packages and methods of packaging semiconductor devices
Micla Wedanni Linsangan, Tan Hua Hong, Ho Beng Yeung, Suthiwongsunthorn Nathapong, Huang Rui, Le Kriangsak Sae, De Vera Nelson Agbisit, Robles Roel Adeva, Dimaano Antonio Jr. Bambalan
Year of Publication 29.11.2016
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Year of Publication 29.11.2016
Patent
Semiconductor packages and methods of packaging semiconductor devices
NATHAPONG SUTHIWONGSUNTHORN, KRIANGSAK SAE LE, WEDANNI LINSANGAN MICLA, ROEL ADEVA ROBLES, RUI HUANG, ANTONIO JR. BAMBALAN DIMAANO, NELSON AGBISIT DE VERA, HUA HONG TAN, BENG YEUNG HO
Year of Publication 03.02.2016
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Year of Publication 03.02.2016
Patent
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
NATHAPONG SUTHIWONGSUNTHORN, KRIANGSAK SAE LE, WEDANNI LINSANGAN MICLA, ROEL ADEVA ROBLES, ANTONIO JR. BAMBALAN DIMAANO, RUI HUANG, HUA HONG TAN, NELSON AGBISIT DE VERA, BENG YEUNG HO
Year of Publication 28.01.2016
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Year of Publication 28.01.2016
Patent
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
NELSON William John, ONG Poh Leng Wilson, HO Beng Yeung, SUTHIWONGSUNTHORN Nathapong
Year of Publication 27.04.2017
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Year of Publication 27.04.2017
Patent
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
HO BENG YEUNG, ONG POH LENG WILSON, SUTHIWONGSUNTHORN NATHAPONG, NELSON WILLIAM JOHN
Year of Publication 14.04.2016
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Year of Publication 14.04.2016
Patent
Layer arrangement and a wafer level package comprising the layer arrangement
NAGARAJAN RANGANATHAN, HO BENG YEUNG, XIE LING, CHIDAMBARAM VIVEK, CHEN BANGTAO
Year of Publication 19.01.2016
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Year of Publication 19.01.2016
Patent
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
LE, Kriangsak Sae, ROBLES, Roel Adeva, TAN, Hua Hong, DE VERA, Nelson Agbisit, SUTHIWONGSUNTHORN, Nathapong, MICLA, Wedanni Linsangan, DIMAANO, Antonio Jr. Bambalan, HUANG, Rui, HO, Beng Yeung
Year of Publication 23.08.2018
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Year of Publication 23.08.2018
Patent
LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER ARRANGEMENT
NAGARAJAN RANGANATHAN, HO BENG YEUNG, XIE LING, CHIDAMBARAM VIVEK, CHEN BANGTAO
Year of Publication 14.05.2015
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Year of Publication 14.05.2015
Patent
A LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER ARRANGEMENT
CHIDAMBARAM, VIVEK, HO, BENG YEUNG, XIE, LING, CHEN, BANGTAO, NAGARAJAN, RANGANATHAN
Year of Publication 30.07.2014
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Year of Publication 30.07.2014
Patent