ETCHING METHOD
NAGATOMO YU, HISHINUMA HAYATO, TAKAYAMA WATARU, KANEKO YUKI, SAITOH YUSUKE, TOMINAGA SHO
Year of Publication 03.03.2022
Get full text
Year of Publication 03.03.2022
Patent
ETCHING METHOD
NAGATOMO YU, HISHINUMA HAYATO, TAKAYAMA KO, KANEKO YUKI, SAITO YUSUKE, TOMINAGA SHO
Year of Publication 11.04.2016
Get full text
Year of Publication 11.04.2016
Patent
ETCHING METHOD
NAGATOMO YU, HISHINUMA HAYATO, TAKAYAMA WATARU, KANEKO YUKI, SAITOH YUSUKE, TOMINAGA SHO
Year of Publication 09.03.2016
Get full text
Year of Publication 09.03.2016
Patent
Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM
Zehua, Du, Kikuchi, Hiroshi, Hishinuma, Hayato, Murugesan, Mariappan, Tanaka, Tetsu, Fukushima, Takafumi
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Etching method
Hishinuma Hayato, Tominaga Sho, Saitoh Yusuke, Kaneko Yuki, Nagatomo Yu, Takayama Wataru
Year of Publication 03.10.2017
Get full text
Year of Publication 03.10.2017
Patent
ETCHING METHOD
NAGATOMO YU, HISHINUMA HAYATO, TAKAYAMA WATARU, KANEKO YUKI, SAITOH YUSUKE, TOMINAGA SHO
Year of Publication 03.03.2016
Get full text
Year of Publication 03.03.2016
Patent
ETCHING METHOD
NAGATOMO YU, HISHINUMA HAYATO, TAKAYAMA WATARU, KANEKO YUKI, SAITOH YUSUKE, TOMINAGA SHO
Year of Publication 09.03.2016
Get full text
Year of Publication 09.03.2016
Patent