Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
Mukawa, Jun, Takahashi, Seiichirou, Kobata, Chihiro, Ohkita, Kenzo, Kusumoto, Shiro, Hasegawa, Koichi, Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Orii, Yasumitsu
Published in Journal of Photopolymer Science and Technology (01.01.2016)
Published in Journal of Photopolymer Science and Technology (01.01.2016)
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Journal Article
Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
Mukawa, Jun, Takahashi, Seiichirou, Kobata, Chihiro, Ohkita, Kenzo, Kusumoto, Shiro, Hasegawa, Koichi, Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Orii, Yasumitsu
Published in Journal of photopolymer science and technology (2016)
Published in Journal of photopolymer science and technology (2016)
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Journal Article
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
Aoki, Toyohiro, Sakuma, Katsuyuki, Mori, Hiroyuki, Nakamura, Koki, Hisada, Takashi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
Chen, Qianwen, Belyansky, Michael, Sulehria, Yasir, Horibe, Akihiro, Qin, Liqiao, Pujari, Ruturaj, Perfecto, Eric, Lie, Fee Li, Butt, Shahid, Polomoff, Nick, Miyazawa, Risa, Kohara, Sayuri, Farooq, Mukta, Hisada, Takashi, Oakley, Jennifer, Skordas, Spyridon, Fan, Susan, Sakuma, Katsuyuki, Knickerbocker, John, Mcherron, Dale, Tamura, Takeshi, Ishii, Takayuki, Jaipan, Panupong, Nishimura, Satoshi, Son, Ilseok, Maeda, Yohei, Koga, Takashi, Klein, Joseph, Tashiro, Kei, Arkalgud, Sitaram, Kondo, Yoshihiro
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
Miyazawa, Risa, Mori, Hiroyuki, Jain, Aakrati, Farooq, Mukta, Hisada, Takashi
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler
Miyazawa, Risa, Hisada, Takashi, Bergendah, Marc, Jain, Aakrati, Sikka, Kamal
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
TOILET BOWL DEVICE
KIMATA ATSUSHI, HISADA TAKASHI, TAKESHITA KOICHI, YAMASHITA TOSHIHIRO
Year of Publication 17.01.2023
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Year of Publication 17.01.2023
Patent
WATER DISCHARGING DEVICE
HISADA TAKASHI, KAWAZOE SHUNSUKE, MIZUNO TAKAYUKI, WAKAHARA KYOSUKE, SATO SHOGO
Year of Publication 17.01.2023
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Year of Publication 17.01.2023
Patent